Difference between revisions of "Equipment"
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* '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]] | * '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]] | ||
* '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]] | * '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]] | ||
| − | * | + | * '''DE-07:''' [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]] ''- cross-listed under Soft Lithography'' |
* '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] | * '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] | ||
* '''DE-09:''' [[Tergeo-Plus Plasma Cleaner | Tergeo-Plus Plasma Cleaner]] | * '''DE-09:''' [[Tergeo-Plus Plasma Cleaner | Tergeo-Plus Plasma Cleaner]] | ||
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* '''LW-01:''' [[Heidelberg DWL 66+ Laser Writer | Heidelberg DWL 66+ Laser Writer]] | * '''LW-01:''' [[Heidelberg DWL 66+ Laser Writer | Heidelberg DWL 66+ Laser Writer]] | ||
* '''LW-02:''' [[Nanoscribe Photonic Professional GT | Nanoscribe Photonic Professional GT]] | * '''LW-02:''' [[Nanoscribe Photonic Professional GT | Nanoscribe Photonic Professional GT]] | ||
| + | * '''LW-03:''' [[DMO MicroWriter ML3 Pro | DMO MicroWriter ML3 Pro ]] | ||
* '''MA-01:''' [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]] | * '''MA-01:''' [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]] | ||
* '''MA-03:''' [[ABM Mask Aligner | ABM Mask Aligner]] ''- cross-listed under Soft Lithography'' | * '''MA-03:''' [[ABM Mask Aligner | ABM Mask Aligner]] ''- cross-listed under Soft Lithography'' | ||
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* '''SPN-01:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Acetone Soluble Photoresist]] | * '''SPN-01:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Acetone Soluble Photoresist]] | ||
* '''SPN-03:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - LOR/PMGI]] | * '''SPN-03:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - LOR/PMGI]] | ||
| − | |||
* '''SPN-06:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - E-Beam Resist]] | * '''SPN-06:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - E-Beam Resist]] | ||
* '''SPN-08:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Negative Epoxy]] ''- cross-listed under Soft Lithography'' | * '''SPN-08:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Negative Epoxy]] ''- cross-listed under Soft Lithography'' | ||
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== Backend & Packaging == | == Backend & Packaging == | ||
| + | === Laser Micro-Machining === | ||
* '''LMM-01:''' [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]] | * '''LMM-01:''' [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]] | ||
* '''LMM-02:''' [[IPG IX280-DXF Green Micromachining Laser | IPG IX280-DXF Green Micromachining Laser]] | * '''LMM-02:''' [[IPG IX280-DXF Green Micromachining Laser | IPG IX280-DXF Green Micromachining Laser]] | ||
| + | === Dicing === | ||
| + | * '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]] | ||
| + | * '''SPN-07:''' [[Spinner - SU-8/PDMS | CEE 200X Spinner]] | ||
| + | * Manual cleaving station | ||
| + | === Wafer Bonding === | ||
* '''BE-01:''' [[EVG 510 Wafer Bonder | EVG 510 Wafer Bonder]] | * '''BE-01:''' [[EVG 510 Wafer Bonder | EVG 510 Wafer Bonder]] | ||
* '''BE-02:''' [[EVG 620 Wafer Bond Aligner | EVG 620 Wafer Bond Aligner]] | * '''BE-02:''' [[EVG 620 Wafer Bond Aligner | EVG 620 Wafer Bond Aligner]] | ||
| + | === Wire Bonding === | ||
* '''BE-03:''' [[K&S Wire Bonder | K&S Wire Bonder]] | * '''BE-03:''' [[K&S Wire Bonder | K&S Wire Bonder]] | ||
| − | |||
* '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]] | * '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]] | ||
| − | + | === Parylene Coater === | |
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]] | * '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]] | ||
== Thermal Processing == | == Thermal Processing == | ||
| + | === Rapid Thermal Annealing === | ||
| + | * '''RTA-01:'''[[RTA-01 | AET Thermal RX - MOS compatible only]] | ||
| + | * '''RTA-02:'''[[RTA-02 | AET Thermal RX - general use]] | ||
| + | |||
| + | === Anneal Furnace === | ||
* '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]] | * '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]] | ||
* '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]] | * '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]] | ||
| − | |||
| − | |||
== Wet Processing == | == Wet Processing == | ||
| + | ===Equipment=== | ||
* '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]] | * '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]] | ||
* '''SRD-01:'''[[RENA Compass Dual Stack Spin Rinse Dryer | RENA Compass Dual Stack Spin Rinse Dryer]] | * '''SRD-01:'''[[RENA Compass Dual Stack Spin Rinse Dryer | RENA Compass Dual Stack Spin Rinse Dryer]] | ||
| + | === Wet Benches=== | ||
* '''WB-06:''' [[HF Processing | Hydrofluoric Acid Processing]] | * '''WB-06:''' [[HF Processing | Hydrofluoric Acid Processing]] | ||
* '''WB-xx:''' [[Bay 3 Wet Bench Processing | Bay 3 Wet Bench Processing]] | * '''WB-xx:''' [[Bay 3 Wet Bench Processing | Bay 3 Wet Bench Processing]] | ||
* '''WB-xx:''' [[General Wet Bench Processing | General Wet Bench Processing]] | * '''WB-xx:''' [[General Wet Bench Processing | General Wet Bench Processing]] | ||
Latest revision as of 15:11, 26 August 2025
Deposition
Physical Vapor Deposition (PVD)
Evaporation
- PVD-01: Lesker Nano-36 Thermal Evaporator
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-04: Lesker PVD75 E-beam Evaporator
- PVD-09: Intlvac E-beam Evaporator
Sputtering
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-05: Denton Explorer14 Magnetron Sputterer
PVD-07: SCS PDS2010 Parylene Coater is listed under Backend & Packaging
PVD-08: Silanization Dessicator is listed under Soft Lithography
Chemical Vapor Deposition (CVD)
- CVD-01: Oxford PlasmaLab 100 PECVD
- CVD-02 (Tube furnaces): Sandvik Furnace Stack - SiO2, SiNx, Anneal tubes
Atomic Layer Deposition (ALD)
- ALD-01: Cambridge Nanotech S200 ALD
ALD-02: Fiji G2 ALD- ALD-03: Veeco Savannah 200
Dry Etching
Ion Milling
- DE-01: IntlVac NanoQuest 1 IBE
Plasma Etch
- DE-02: Anatech SCE-108 Barrel Asher
- DE-03: SPTS Si DRIE
- DE-04: Oxford 80 Plus RIE
- DE-05: Oxford Cobra ICP Etcher
- DE-07: Anatech SCE-106 Barrel Asher - cross-listed under Soft Lithography
- DE-08: Jupiter II RIE Plasma Etcher
- DE-09: Tergeo-Plus Plasma Cleaner
Vapor Etch
Lithography
E-beam Lithography
- EBL-01: Elionix ELS-7500EX E-Beam Lithography System
- EBL-02: Litho Workstation for BEAMER and TRACER
- EBL-03: Raith EBPG5200+ E-Beam Lithography System
Photolithography
- LW-01: Heidelberg DWL 66+ Laser Writer
- LW-02: Nanoscribe Photonic Professional GT
- LW-03: DMO MicroWriter ML3 Pro
- MA-01: SUSS MicroTec MA6 Gen3 Mask Aligner
- MA-03: ABM Mask Aligner - cross-listed under Soft Lithography
Imprint Lithography
- MA-02: Nanonex NX2600 Nanoimprint
Soft Lithography
- DE-07: Anatech SCE-106 Barrel Asher
- MA-03: ABM Mask Aligner
- PVD-08: Silanization Dessicator
- SPN-08: CEE Apogee Spinner - Negative Epoxy
- SPN-09: CEE Apogee Spinner - PDMS
Resist Coating
- RC-01: SUSS MicroTec AS8 AltaSpray
- SPN-01: CEE Apogee Spinner - Acetone Soluble Photoresist
- SPN-03: CEE Apogee Spinner - LOR/PMGI
- SPN-06: CEE Apogee Spinner - E-Beam Resist
- SPN-08: CEE Apogee Spinner - Negative Epoxy - cross-listed under Soft Lithography
Metrology & characterization
Stylus profilometers
- MET-01: KLA Tencor P7 2D profilometer
- MET-02: KLA Tencor P7 2D&3D/stress profilometer
Optical profilometers
- MET-05: Filmetrics Profilm3D
Reflectometers
- MET-03: Filmetrics F50 (UV Filter)
- MET-04: Filmetrics F40
- MET-11: Filmetrics F50 (White Light)
Ellipsometer
- MET-06: Woollam V-VASE Ellipsometer
Electrical characterization
Microscopes
- MET-10: Zeiss Smartzoom5 2D/3D Optical Microscope
- MET-12, MET-13, MET-14, MET-15: Zeiss Axio Imager M2m Microscopes
Backend & Packaging
Laser Micro-Machining
Dicing
- BE-04: ADT 7100 Dicing Saw
- SPN-07: CEE 200X Spinner
- Manual cleaving station
Wafer Bonding
- BE-01: EVG 510 Wafer Bonder
- BE-02: EVG 620 Wafer Bond Aligner
Wire Bonding
- BE-03: K&S Wire Bonder
- BE-06: TPT HB100 Wire Bonder
Parylene Coater
- PVD-07: SCS PDS2010 Parylene Coater
Thermal Processing
Rapid Thermal Annealing
- RTA-01: AET Thermal RX - MOS compatible only
- RTA-02: AET Thermal RX - general use
Anneal Furnace
- CVD-02C: Sandvik Anneal Furnace 1
- CVD-02D: Sandvik Anneal Furnace 2
Wet Processing
Equipment
Wet Benches
- WB-06: Hydrofluoric Acid Processing
- WB-xx: Bay 3 Wet Bench Processing
- WB-xx: General Wet Bench Processing