TPT HB100 Wire Bonder
Jump to navigation
Jump to search
 |
|
| Tool Name | TPT HB100 Wire Bonder |
|---|---|
| Instrument Type | Back End |
| Staff Manager | Eric Johnston |
| Lab Location | Bay 2 |
| Tool Manufacturer | TPT |
| Tool Model | HB100 |
| NEMO Designation | BE-06 |
| Nearest Phone | XXXXX |
| SOP Link | BE-06 SOP |
Description
The HB100 is an ultrasonic wire bonder offering a high-precision X-Y-Z and Theta control. All parameters, such as bonding force, ultrasonic power, time & temperature are controlled digitally. The bonder offers reliable wire and ribbon handling through vertical feed and motorized clamp. The system can be configured for both aluminum and gold wire bonding at varying wire diameters. Available bonding programs include: aluminum wedge-wedge, gold ball-wedge, gold bump, and gold wedge-wedge. Samples up to 8cm in length can be secured to the stage using the two-jaw clamp. The stage can also be heated up to 250℃ if needed to improve bond quality.
Applications
- Aluminum wedge wire bonding
- Gold ball-wedge wire bonding
- Gold bump bonding
Resources
SOP