EVG 620 Wafer Bond Aligner

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EVG 620 Wafer Bond Aligner
BE-02.jpeg
Tool Name EVG 620 Wafer Bond Aligner
Instrument Type Back End
Staff Manager Eric Johnston
Lab Location Bay 2
Tool Manufacturer EV Group
Tool Model 620 Aligner
Iris Designation BE-02
Lab Phone XXXXX
SOP Link SOP

Description

Known for its high level of automation and reliability, the EVG620 Bond Alignment System is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. The EV Group´s bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG´s bond alignment system accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.

Applications
  • Aligning 4" wafers for bonding in the EVG 620
  • Maximum stack height: 4.5 mm
  • Range of alignment: X, Y ± 5.0 mm
  • Alignment accuracy:
  • 0.5 um for glass/silicon
  • 1.0 um for silicon/silicon
  • Contact force: 1-40 N


Resources

SOPs & Troubleshooting