Difference between revisions of "Equipment"

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(→‎Resist Coating: removed SPN-04)
 
(15 intermediate revisions by 2 users not shown)
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* '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
 
* '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
  
−
'' '''PVD-07''' is listed under Soft Lithography'' <br>
+
'' '''PVD-07: SCS PDS2010 Parylene Coater''' is listed under Backend & Packaging'' <br>
−
'' '''PVD-08''' is listed under Soft Lithography''
+
'' '''PVD-08: Silanization Dessicator''' is listed under Soft Lithography''
  
 
=== [[What is Chemical Vapor Deposition (CVD)?|Chemical Vapor Deposition (CVD)]] ===
 
=== [[What is Chemical Vapor Deposition (CVD)?|Chemical Vapor Deposition (CVD)]] ===
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* '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]]
 
* '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]]
  
−
== Etching ==
+
== Dry Etching ==
−
 
 
−
''[[How plasma etch works|Plasma Etching Overview]]''
 
  
 
=== Ion Milling ===
 
=== Ion Milling ===
 
* '''DE-01:''' [[IntlVac NanoQuest 1 IBE |IntlVac NanoQuest 1 IBE]]
 
* '''DE-01:''' [[IntlVac NanoQuest 1 IBE |IntlVac NanoQuest 1 IBE]]
  
−
=== Plasma Etch ===
+
=== [[How plasma etch works|Plasma Etch]] ===
 
* '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]]
 
* '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]]
 
* '''DE-03:''' [[SPTS Si DRIE | SPTS Si DRIE]]   
 
* '''DE-03:''' [[SPTS Si DRIE | SPTS Si DRIE]]   
 
* '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]]
 
* '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]]
 
* '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]]
 
* '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]]
−
* '' '''DE-07''' is listed under Soft Lithography''
+
* '''DE-07:''' [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]] ''- cross-listed under Soft Lithography''
 
* '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]]
 
* '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]]
 
* '''DE-09:''' [[Tergeo-Plus Plasma Cleaner | Tergeo-Plus Plasma Cleaner]]
 
* '''DE-09:''' [[Tergeo-Plus Plasma Cleaner | Tergeo-Plus Plasma Cleaner]]
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* '''EBL-03:''' [[ Raith EBPG5200+ E-Beam Lithography System | Raith EBPG5200+ E-Beam Lithography System ]]
 
* '''EBL-03:''' [[ Raith EBPG5200+ E-Beam Lithography System | Raith EBPG5200+ E-Beam Lithography System ]]
  
−
=== Laser Lithography ===
+
=== [[Photolithography]] ===
 
* '''LW-01:''' [[Heidelberg DWL 66+ Laser Writer | Heidelberg DWL 66+ Laser Writer]]
 
* '''LW-01:''' [[Heidelberg DWL 66+ Laser Writer | Heidelberg DWL 66+ Laser Writer]]
 
* '''LW-02:''' [[Nanoscribe Photonic Professional GT | Nanoscribe Photonic Professional GT]]
 
* '''LW-02:''' [[Nanoscribe Photonic Professional GT | Nanoscribe Photonic Professional GT]]
−
 
+
* '''LW-03:''' [[DMO MicroWriter ML3 Pro | DMO MicroWriter ML3 Pro ]]
−
=== Photolithography ===
 
 
* '''MA-01:''' [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]]
 
* '''MA-01:''' [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]]
 +
* '''MA-03:''' [[ABM Mask Aligner | ABM Mask Aligner]] ''- cross-listed under Soft Lithography''
  
 
=== Imprint Lithography ===
 
=== Imprint Lithography ===
 
* '''MA-02:''' [[Nanonex NX2600 Nanoimprint | Nanonex NX2600 Nanoimprint]]
 
* '''MA-02:''' [[Nanonex NX2600 Nanoimprint | Nanonex NX2600 Nanoimprint]]
 +
 +
=== [[Soft Lithography]] ===
 +
* '''DE-07:''' [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]]
 +
* '''MA-03:''' [[ABM Mask Aligner | ABM Mask Aligner]]
 +
* '''PVD-08:''' Silanization Dessicator
 +
* '''SPN-08:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Negative Epoxy]]
 +
* '''SPN-09:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - PDMS]]
  
 
=== Resist Coating ===
 
=== Resist Coating ===
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* '''SPN-01:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Acetone Soluble Photoresist]]
 
* '''SPN-01:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Acetone Soluble Photoresist]]
 
* '''SPN-03:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - LOR/PMGI]]
 
* '''SPN-03:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - LOR/PMGI]]
−
* '''SPN-04:''' ReynoldsTech Spinner - Negative Resist
 
 
* '''SPN-06:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - E-Beam Resist]]
 
* '''SPN-06:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - E-Beam Resist]]
−
 
+
* '''SPN-08:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Negative Epoxy]] ''- cross-listed under Soft Lithography''
−
* '' '''SPN-07''' is listed under Back End Processing'' <br>
 
−
* '' '''SPN-08''' is listed under Soft Lithography'' <br>
 
−
* '' '''SPN-09''' is listed under Soft Lithography''
 
−
 
 
−
=== Soft Lithography ===
 
−
* '''DE-07:''' [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]]
 
−
* '''MA-03:''' [[ABM Mask Aligner | ABM Mask Aligner]]
 
−
* '''PVD-08:''' Silanization Dessicator
 
−
* '''SPN-08:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Negative Epoxy]]
 
−
* '''SPN-09:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - PDMS]]
 
  
 
== Metrology & characterization ==
 
== Metrology & characterization ==
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=== Microscopes ===
 
=== Microscopes ===
 
* '''MET-10:''' Zeiss Smartzoom5 2D/3D Optical Microscope
 
* '''MET-10:''' Zeiss Smartzoom5 2D/3D Optical Microscope
−
* '''MET-12:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (1/4)
+
* '''MET-12, MET-13, MET-14, MET-15:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]]
−
* '''MET-13:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (2/4)
 
−
* '''MET-14:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (3/4)
 
−
* '''MET-15:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (4/4)
 
  
 
== Backend & Packaging ==
 
== Backend & Packaging ==
 +
=== Laser Micro-Machining ===
 
* '''LMM-01:''' [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]]
 
* '''LMM-01:''' [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]]
 
* '''LMM-02:''' [[IPG IX280-DXF Green Micromachining Laser | IPG IX280-DXF Green Micromachining Laser]]
 
* '''LMM-02:''' [[IPG IX280-DXF Green Micromachining Laser | IPG IX280-DXF Green Micromachining Laser]]
 +
=== Dicing ===
 +
* '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]]
 +
* '''SPN-07:''' [[Spinner - SU-8/PDMS | CEE 200X Spinner]]
 +
* Manual cleaving station
 +
=== Wafer Bonding ===
 
* '''BE-01:''' [[EVG 510 Wafer Bonder | EVG 510 Wafer Bonder]]
 
* '''BE-01:''' [[EVG 510 Wafer Bonder | EVG 510 Wafer Bonder]]
 
* '''BE-02:''' [[EVG 620 Wafer Bond Aligner | EVG 620 Wafer Bond Aligner]]
 
* '''BE-02:''' [[EVG 620 Wafer Bond Aligner | EVG 620 Wafer Bond Aligner]]
 +
=== Wire Bonding ===
 
* '''BE-03:''' [[K&S Wire Bonder | K&S Wire Bonder]]
 
* '''BE-03:''' [[K&S Wire Bonder | K&S Wire Bonder]]
−
* '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]]
 
 
* '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]]
 
* '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]]
−
* '''SPN-07:''' [[Spinner - SU-8/PDMS | CEE 200X Spinner]]
+
=== Parylene Coater ===
 
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
 
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
  
 
== Thermal Processing ==
 
== Thermal Processing ==
 +
=== Rapid Thermal Annealing ===
 +
* '''RTA-01:'''[[RTA-01 | AET Thermal RX - MOS compatible only]]
 +
* '''RTA-02:'''[[RTA-02 | AET Thermal RX - general use]]
 +
 +
=== Anneal Furnace ===
 
* '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]]
 
* '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]]
 
* '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]]
 
* '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]]
−
* '''RTA-01:'''[[RTA-01 | RTA-01]]
 
−
* '''RTA-02:'''[[RTA-02 | RTA-02]]
 
  
 
== Wet Processing ==
 
== Wet Processing ==
 +
===Equipment===
 
* '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]]
 
* '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]]
 
* '''SRD-01:'''[[RENA Compass Dual Stack Spin Rinse Dryer | RENA Compass Dual Stack Spin Rinse Dryer]]
 
* '''SRD-01:'''[[RENA Compass Dual Stack Spin Rinse Dryer | RENA Compass Dual Stack Spin Rinse Dryer]]
 +
=== Wet Benches===
 
* '''WB-06:''' [[HF Processing | Hydrofluoric Acid Processing]]
 
* '''WB-06:''' [[HF Processing | Hydrofluoric Acid Processing]]
 
* '''WB-xx:''' [[Bay 3 Wet Bench Processing | Bay 3 Wet Bench Processing]]
 
* '''WB-xx:''' [[Bay 3 Wet Bench Processing | Bay 3 Wet Bench Processing]]
 
* '''WB-xx:''' [[General Wet Bench Processing | General Wet Bench Processing]]
 
* '''WB-xx:''' [[General Wet Bench Processing | General Wet Bench Processing]]

Latest revision as of 15:11, 26 August 2025

Deposition

Physical Vapor Deposition (PVD)

PVD Equipment Overview

Evaporation

Sputtering

PVD-07: SCS PDS2010 Parylene Coater is listed under Backend & Packaging
PVD-08: Silanization Dessicator is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Dry Etching

Ion Milling

Plasma Etch

Vapor Etch

Lithography

E-beam Lithography

Photolithography

Imprint Lithography

Soft Lithography

Resist Coating

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Laser Micro-Machining

Dicing

Wafer Bonding

Wire Bonding

Parylene Coater

Thermal Processing

Rapid Thermal Annealing

Anneal Furnace

Wet Processing

Equipment

Wet Benches

Retrieved from "https://wiki.nano.upenn.edu/wiki/index.php?title=Equipment&oldid=2894"