Equipment

Deposition

Physical Vapor Deposition (PVD)

PVD Equipment Overview

Evaporation

• PVD-01: Lesker Nano-36 Thermal Evaporator
• PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
• PVD-04: Lesker PVD75 E-beam Evaporator
• PVD-09: Intlvac E-beam Evaporator

Sputtering

• PVD-03: Lesker PVD75 DC/RF Sputterer
• PVD-05: Denton Explorer14 Magnetron Sputterer

PVD-07: SCS PDS2010 Parylene Coater is listed under Backend & Packaging
PVD-08: Silanization Dessicator is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

• CVD-01: Oxford PlasmaLab 100 PECVD
• CVD-02 (Tube furnaces): Sandvik Furnace Stack - SiO₂, SiN_x, Anneal tubes

Atomic Layer Deposition (ALD)

• ALD-01: Cambridge Nanotech S200 ALD
• ALD-02: Fiji G2 ALD
• ALD-03: Veeco Savannah 200

Etching

Plasma Etching Overview

Ion Milling

• DE-01: IntlVac NanoQuest 1 IBE

Plasma Etch

• DE-02: Anatech SCE-108 Barrel Asher
• DE-03: SPTS Si DRIE
• DE-04: Oxford 80 Plus RIE
• DE-05: Oxford Cobra ICP Etcher
• DE-07 is listed under Soft Lithography
• DE-08: Jupiter II RIE Plasma Etcher
• DE-09: Tergeo-Plus Plasma Cleaner

Vapor Etch

• DE-06: SPTS/Xactix XeF2 Isotropic Etcher

Lithography

E-beam Lithography

• EBL-01: Elionix ELS-7500EX E-Beam Lithography System
• EBL-02: Litho Workstation for BEAMER and TRACER
• EBL-03: Raith EBPG5200+ E-Beam Lithography System

Photolithography

• LW-01: Heidelberg DWL 66+ Laser Writer
• LW-02: Nanoscribe Photonic Professional GT
• MA-01: SUSS MicroTec MA6 Gen3 Mask Aligner
• MA-03: ABM Mask Aligner - cross-listed under Soft Lithography

Imprint Lithography

• MA-02: Nanonex NX2600 Nanoimprint

Soft Lithography

• DE-07: Anatech SCE-106 Barrel Asher
• MA-03: ABM Mask Aligner
• PVD-08: Silanization Dessicator
• SPN-08: CEE Apogee Spinner - Negative Epoxy
• SPN-09: CEE Apogee Spinner - PDMS

Resist Coating

• RC-01: SUSS MicroTec AS8 AltaSpray
• SPN-01: CEE Apogee Spinner - Acetone Soluble Photoresist
• SPN-03: CEE Apogee Spinner - LOR/PMGI
• SPN-04: ReynoldsTech Spinner - Negative Resist
• SPN-06: CEE Apogee Spinner - E-Beam Resist
• SPN-08: CEE Apogee Spinner - Negative Epoxy - cross-listed under Soft Lithography

Metrology & characterization

Stylus profilometers

• MET-01: KLA Tencor P7 2D profilometer
• MET-02: KLA Tencor P7 2D&3D/stress profilometer

Optical profilometers

• MET-05: Filmetrics Profilm3D

Reflectometers

• MET-03: Filmetrics F50 (UV Filter)
• MET-04: Filmetrics F40
• MET-11: Filmetrics F50 (White Light)

Ellipsometer

• MET-06: Woollam V-VASE Ellipsometer

Electrical characterization

• MET-08: Jandel Multi Height Four Point Probe
• MET-09: Micromanipulator 4060 Probe Station

Microscopes

• MET-10: Zeiss Smartzoom5 2D/3D Optical Microscope
• MET-12: Zeiss Axio Imager M2m Microscopes (1/4)
• MET-13: Zeiss Axio Imager M2m Microscopes (2/4)
• MET-14: Zeiss Axio Imager M2m Microscopes (3/4)
• MET-15: Zeiss Axio Imager M2m Microscopes (4/4)

Backend & Packaging

• LMM-01: IPG IX-255 Excimer Micromachining Laser
• LMM-02: IPG IX280-DXF Green Micromachining Laser
• BE-01: EVG 510 Wafer Bonder
• BE-02: EVG 620 Wafer Bond Aligner
• BE-03: K&S Wire Bonder
• BE-04: ADT 7100 Dicing Saw
• BE-06: TPT HB100 Wire Bonder
• SPN-07: CEE 200X Spinner
• PVD-07: SCS PDS2010 Parylene Coater

Thermal Processing

• CVD-02C: Sandvik Anneal Furnace 1
• CVD-02D: Sandvik Anneal Furnace 2
• RTA-01: RTA-01
• RTA-02: RTA-02

Wet Processing

• CPD-01: Tousimis Critical Point Dryer
• SRD-01: RENA Compass Dual Stack Spin Rinse Dryer
• WB-06: Hydrofluoric Acid Processing
• WB-xx: Bay 3 Wet Bench Processing
• WB-xx: General Wet Bench Processing