Difference between revisions of "Equipment"

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=== [[How plasma etch works|Plasma Etch]] ===
 
=== [[How plasma etch works|Plasma Etch]] ===
 +
* '''DE-01:''' [[IntlVac NanoQuest 1 IBE |IntlVac NanoQuest 1 IBE]]
 
* '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]]
 
* '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]]
 
* '''DE-03:''' [[SPTS Si DRIE | SPTS Si DRIE]]   
 
* '''DE-03:''' [[SPTS Si DRIE | SPTS Si DRIE]]   

Revision as of 13:19, 30 September 2024

Deposition

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Etching

Plasma Etch

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • SPN-07 is listed under Back End Processing
  • SPN-08 is listed under Soft Lithography
  • SPN-09 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing