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- 10:36, 9 April 2024 diff hist +34 SPTS Si DRIE →Post etch sample cleaning procedure current
- 13:12, 4 April 2024 diff hist 0 Equipment →Etching
- 09:01, 26 March 2024 diff hist -13 How plasma etch works →Basics of Plasma Etching current
- 09:00, 26 March 2024 diff hist +1 How plasma etch works →How Bosch Process (a.k.a DRIE) works
- 08:57, 26 March 2024 diff hist -28 How plasma etch works
- 16:56, 25 March 2024 diff hist +2 How plasma etch works
- 16:56, 25 March 2024 diff hist -2 How plasma etch works
- 16:56, 25 March 2024 diff hist +8 How plasma etch works
- 16:55, 25 March 2024 diff hist +207 How plasma etch works
- 16:53, 25 March 2024 diff hist +8 How plasma etch works
- 16:53, 25 March 2024 diff hist -2 How plasma etch works
- 16:52, 25 March 2024 diff hist +134 How plasma etch works
- 16:46, 25 March 2024 diff hist +15 How plasma etch works →How Bosch Process (a.k.a DRIE) works
- 16:25, 25 March 2024 diff hist +2 Quattrone Nanofabrication Facility current
- 16:24, 25 March 2024 diff hist +11 Quattrone Nanofabrication Facility
- 16:08, 25 March 2024 diff hist -46 Equipment
- 16:07, 25 March 2024 diff hist -2 How plasma etch works
- 16:07, 25 March 2024 diff hist +32 How plasma etch works
- 16:05, 25 March 2024 diff hist -299 How plasma etch works →How Bosch Process (a.k.a DRIE) works
- 16:05, 25 March 2024 diff hist +8 How plasma etch works
- 16:03, 25 March 2024 diff hist -13 How plasma etch works →How Bosch Process (a.k.a DRIE) works
- 16:02, 25 March 2024 diff hist +2,702 How plasma etch works
- 15:56, 25 March 2024 diff hist +16 How plasma etch works
- 15:55, 25 March 2024 diff hist +2,370 How plasma etch works →The difference between RIE and ICP-RIE
- 15:54, 25 March 2024 diff hist -370 How plasma etch works
- 15:50, 25 March 2024 diff hist +10 How plasma etch works
- 15:49, 25 March 2024 diff hist +6 How plasma etch works
- 15:49, 25 March 2024 diff hist +30 How plasma etch works
- 15:46, 25 March 2024 diff hist +3,243 N How plasma etch works Created page with "Plasma etching is a crucial process in semiconductor manufacturing, enabling the precise fabrication of intricate patterns on silicon wafers. This technique is fundamental in..."
- 15:46, 25 March 2024 diff hist -1 Equipment →Etching
- 15:45, 25 March 2024 diff hist +3,243 N Ever wondered how plasma etch works? Created page with "Plasma etching is a crucial process in semiconductor manufacturing, enabling the precise fabrication of intricate patterns on silicon wafers. This technique is fundamental in..." current
- 15:45, 25 March 2024 diff hist +74 Equipment →Etching
- 13:47, 20 March 2024 diff hist +11 Fiji G2 ALD →Description current
- 11:06, 20 March 2024 diff hist -4 Fiji G2 ALD
- 10:58, 20 March 2024 diff hist 0 Fiji G2 ALD
- 10:57, 20 March 2024 diff hist +942 N Fiji G2 ALD Created page with "Category:Deposition {{EquipmentInfo | name = Veeco Fiji G2 | Tool_Name = Veeco Figi G2 | image = 300px | imagecaption = | Instrument_Type = Deposit..."
- 10:57, 20 March 2024 diff hist -18 Veeco Savannah 200 current
- 10:35, 20 March 2024 diff hist +46 Equipment →Chemical Vapor Deposition (CVD)
- 14:54, 5 March 2024 diff hist +80 Oxford 80 Plus RIE →Etch Rate current
- 17:43, 13 February 2024 diff hist -408 Filmetrics F50 (White Light) →Applications current
- 17:41, 13 February 2024 diff hist +407 Filmetrics F50 (White Light) →Description
- 15:29, 13 February 2024 diff hist 0 Cambridge Nanotech S200 ALD →Standard Processes current
- 13:13, 12 February 2024 diff hist 0 Cambridge Nanotech S200 ALD →Standard Processes
- 10:11, 29 January 2024 diff hist +184 Sandvik Furnace Stack BYU has an excellent online calculator you can use to find out how much time your process would take for a given thickness and temperature. https://cleanroom.byu.edu/oxidetimecalc current
- 10:06, 29 January 2024 diff hist +180 Sandvik Furnace Stack →Description
- 18:01, 25 January 2024 diff hist -148 Cambridge Nanotech S200 ALD →Standard Processes
- 14:26, 23 January 2024 diff hist +155 Cambridge Nanotech S200 ALD →Resources
- 14:25, 23 January 2024 diff hist -154 Veeco Savannah 200 →Protocols and Reports
- 16:19, 10 January 2024 diff hist +4 Oxford 80 Plus RIE →The following materials are not allowed in the chamber
- 15:29, 9 January 2024 diff hist +43 Oxford PlasmaLab 100 PECVD →Process information current