Difference between revisions of "Equipment"
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− | == Deposition == | + | ==Deposition== |
− | ===== Evaporation | + | === [[How PVD works|Physical Vapor Deposition (PVD)]] === |
− | * [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]] | + | ''[[PVD Equipment Overview|PVD Equipment Overview]]'' |
− | * [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]] | + | ==== [[PVD Equipment Overview|Evaporation]] ==== |
− | * [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]] | + | * '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]] |
+ | * '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]] | ||
+ | * '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]] | ||
+ | * '''PVD-09:''' [[Intlvac E-beam Evaporator | Intlvac E-beam Evaporator]] | ||
− | ==== | + | ==== [[PVD Equipment Overview|Sputtering]] ==== |
− | * [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]] | + | * '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]] |
− | * [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]] | + | * '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]] |
− | + | '' '''PVD-07''' is listed under Soft Lithography'' <br> | |
− | + | '' '''PVD-08''' is listed under Soft Lithography'' | |
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− | = | + | === [[What is Chemical Vapor Deposition (CVD)?|Chemical Vapor Deposition (CVD)]] === |
− | + | * '''CVD-01:''' [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]] | |
− | * | + | * '''CVD-02 (Tube furnaces):''' [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]] |
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− | * | ||
− | ==== Vapor / Wet Etch | + | === [[What is Atomic Layer Deposition?|Atomic Layer Deposition (ALD)]] === |
− | * SPTS/Xactix XeF2 Isotropic Etcher | + | * '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]] |
+ | * '''ALD-02:''' [[Fiji G2 ALD | Fiji G2 ALD]] | ||
+ | * '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]] | ||
+ | |||
+ | == Etching == | ||
+ | |||
+ | ''[[How plasma etch works|Plasma Etching Overview]]'' | ||
+ | |||
+ | === Ion Milling === | ||
+ | * '''DE-01:''' [[IntlVac NanoQuest 1 IBE |IntlVac NanoQuest 1 IBE]] | ||
+ | |||
+ | === Plasma Etch === | ||
+ | * '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]] | ||
+ | * '''DE-03:''' [[SPTS Si DRIE | SPTS Si DRIE]] | ||
+ | * '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]] | ||
+ | * '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]] | ||
+ | * '' '''DE-07''' is listed under Soft Lithography'' | ||
+ | * '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] | ||
+ | |||
+ | === Vapor/Wet Etch === | ||
+ | * '''DE-06:''' [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]] | ||
== Lithography == | == Lithography == | ||
− | + | === E-beam Lithography === | |
− | * [[ Elionix ELS-7500EX E-Beam Lithography System | Elionix ELS-7500EX E-Beam Lithography System ]] | + | * '''EBL-01:''' [[ Elionix ELS-7500EX E-Beam Lithography System | Elionix ELS-7500EX E-Beam Lithography System ]] |
− | * Litho Workstation for BEAMER and TRACER | + | * '''EBL-02:''' [[Litho Workstation for BEAMER and TRACER | Litho Workstation for BEAMER and TRACER]] |
+ | * '''EBL-03:''' [[ Raith EBPG5200+ E-Beam Lithography System | Raith EBPG5200+ E-Beam Lithography System ]] | ||
− | + | === Laser Lithography === | |
− | * Heidelberg DWL 66+ Laser Writer | + | * '''LW-01:''' [[Heidelberg DWL 66+ Laser Writer | Heidelberg DWL 66+ Laser Writer]] |
− | * Nanoscribe Photonic Professional GT | + | * '''LW-02:''' [[Nanoscribe Photonic Professional GT | Nanoscribe Photonic Professional GT]] |
− | + | === Photolithography === | |
− | * SUSS MicroTec MA6 Gen3 Mask Aligner | + | * '''MA-01:''' [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]] |
− | + | === Imprint Lithography === | |
− | * Nanonex NX2600 Nanoimprint | + | * '''MA-02:''' [[Nanonex NX2600 Nanoimprint | Nanonex NX2600 Nanoimprint]] |
− | + | === Resist Coating === | |
− | * | + | * '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]] |
− | * Spinner - | + | * '''SPN-01:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Acetone Soluble Photoresist]] |
− | * Spinner - | + | * '''SPN-03:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - LOR/PMGI]] |
− | * Spinner - Negative Resist | + | * '''SPN-04:''' ReynoldsTech Spinner - Negative Resist |
− | * Spinner - E-Beam Resist | + | * '''SPN-06:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - E-Beam Resist]] |
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− | == Soft Lithography == | + | * '' '''SPN-07''' is listed under Back End Processing'' <br> |
− | * Anatech SCE-106 Barrel Asher | + | * '' '''SPN-08''' is listed under Soft Lithography'' <br> |
− | * [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]] | + | * '' '''SPN-09''' is listed under Soft Lithography'' |
− | * SCS PDS2010 Parylene Coater | + | |
− | * Silanization Dessicator | + | === Soft Lithography === |
− | * Spinner - | + | * '''DE-07:''' [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]] |
+ | * '''MA-03:''' [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]] | ||
+ | * '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]] | ||
+ | * '''PVD-08:''' Silanization Dessicator | ||
+ | * '''SPN-08:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Negative Epoxy]] | ||
+ | * '''SPN-09:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - PDMS]] | ||
+ | |||
+ | == Metrology & characterization == | ||
+ | === Stylus profilometers === | ||
+ | * '''MET-01:''' [[KLA Tencor P7 2D profilometer | KLA Tencor P7 2D profilometer]] | ||
+ | * '''MET-02:''' [[KLA Tencor P7 2D&3D/stress profilometer | KLA Tencor P7 2D&3D/stress profilometer]] | ||
+ | |||
+ | === Optical profilometers === | ||
+ | * '''MET-05:''' [[Filmetrics Profilm3D | Filmetrics Profilm3D]] | ||
+ | |||
+ | === Reflectometers === | ||
+ | * '''MET-03:''' [[Filmetrics F50 (UV Filter) | Filmetrics F50 (UV Filter)]] | ||
+ | * '''MET-04:''' [[Filmetrics F40 | Filmetrics F40]] | ||
+ | * '''MET-11:''' [[Filmetrics F50 (White Light) | Filmetrics F50 (White Light)]] | ||
+ | |||
+ | === Ellipsometer === | ||
+ | * '''MET-06:''' [[Woollam V-VASE Ellipsometer | Woollam V-VASE Ellipsometer]] | ||
+ | |||
+ | === Electrical characterization === | ||
+ | * '''MET-08:''' [[Jandel Multi Height Four Point Probe | Jandel Multi Height Four Point Probe]] | ||
+ | * '''MET-09:''' [[Micromanipulator 4060 Probe Station | Micromanipulator 4060 Probe Station]] | ||
+ | |||
+ | === Microscopes === | ||
+ | * '''MET-10:''' Zeiss Smartzoom5 2D/3D Optical Microscope | ||
+ | * '''MET-12:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (1/4) | ||
+ | * '''MET-13:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (2/4) | ||
+ | * '''MET-14:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (3/4) | ||
+ | * '''MET-15:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (4/4) | ||
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== Backend & Packaging == | == Backend & Packaging == | ||
− | * [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]] | + | * '''LMM-01:''' [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]] |
− | * IPG IX280-DXF Green Micromachining Laser | + | * '''LMM-02:''' [[IPG IX280-DXF Green Micromachining Laser | IPG IX280-DXF Green Micromachining Laser]] |
− | * EVG 510 Wafer Bonder | + | * '''BE-01:''' [[EVG 510 Wafer Bonder | EVG 510 Wafer Bonder]] |
− | * EVG 620 Wafer Bond Aligner | + | * '''BE-02:''' [[EVG 620 Wafer Bond Aligner | EVG 620 Wafer Bond Aligner]] |
− | * K&S Wire Bonder | + | * '''BE-03:''' [[K&S Wire Bonder | K&S Wire Bonder]] |
− | * ADT 7100 Dicing Saw | + | * '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]] |
− | * | + | * '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]] |
− | * Dimatix ink-Jet Printer | + | * '''SPN-07:''' [[Spinner - SU-8/PDMS | CEE 200X Spinner]] |
+ | * Dimatix ink-Jet Printer | ||
== Thermal Processing == | == Thermal Processing == | ||
− | * | + | * '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]] |
− | + | * '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]] | |
− | * Sandvik Anneal Furnace 2 | + | * '''RTA-01:'''[[RTA-01 | RTA01]] |
+ | * '''RTA-02:'''[[RTA02 | RTA02]] | ||
+ | |||
+ | == Wet Processing == | ||
+ | * '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]] | ||
+ | * '''SRD-01:'''[[RENA Compass Dual Stack Spin Rinse Dryer | RENA Compass Dual Stack Spin Rinse Dryer]] |
Latest revision as of 11:20, 3 October 2024
Deposition
Physical Vapor Deposition (PVD)
Evaporation
- PVD-01: Lesker Nano-36 Thermal Evaporator
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-04: Lesker PVD75 E-beam Evaporator
- PVD-09: Intlvac E-beam Evaporator
Sputtering
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-05: Denton Explorer14 Magnetron Sputterer
PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography
Chemical Vapor Deposition (CVD)
- CVD-01: Oxford PlasmaLab 100 PECVD
- CVD-02 (Tube furnaces): Sandvik Furnace Stack - SiO2, SiNx, Anneal tubes
Atomic Layer Deposition (ALD)
- ALD-01: Cambridge Nanotech S200 ALD
- ALD-02: Fiji G2 ALD
- ALD-03: Veeco Savannah 200
Etching
Ion Milling
- DE-01: IntlVac NanoQuest 1 IBE
Plasma Etch
- DE-02: Anatech SCE-108 Barrel Asher
- DE-03: SPTS Si DRIE
- DE-04: Oxford 80 Plus RIE
- DE-05: Oxford Cobra ICP Etcher
- DE-07 is listed under Soft Lithography
- DE-08: Jupiter II RIE Plasma Etcher
Vapor/Wet Etch
Lithography
E-beam Lithography
- EBL-01: Elionix ELS-7500EX E-Beam Lithography System
- EBL-02: Litho Workstation for BEAMER and TRACER
- EBL-03: Raith EBPG5200+ E-Beam Lithography System
Laser Lithography
Photolithography
Imprint Lithography
- MA-02: Nanonex NX2600 Nanoimprint
Resist Coating
- RC-01: SUSS MicroTec AS8 AltaSpray
- SPN-01: CEE Apogee Spinner - Acetone Soluble Photoresist
- SPN-03: CEE Apogee Spinner - LOR/PMGI
- SPN-04: ReynoldsTech Spinner - Negative Resist
- SPN-06: CEE Apogee Spinner - E-Beam Resist
- SPN-07 is listed under Back End Processing
- SPN-08 is listed under Soft Lithography
- SPN-09 is listed under Soft Lithography
Soft Lithography
- DE-07: Anatech SCE-106 Barrel Asher
- MA-03: ABM3000HR Mask Aligner
- PVD-07: SCS PDS2010 Parylene Coater
- PVD-08: Silanization Dessicator
- SPN-08: CEE Apogee Spinner - Negative Epoxy
- SPN-09: CEE Apogee Spinner - PDMS
Metrology & characterization
Stylus profilometers
- MET-01: KLA Tencor P7 2D profilometer
- MET-02: KLA Tencor P7 2D&3D/stress profilometer
Optical profilometers
- MET-05: Filmetrics Profilm3D
Reflectometers
- MET-03: Filmetrics F50 (UV Filter)
- MET-04: Filmetrics F40
- MET-11: Filmetrics F50 (White Light)
Ellipsometer
- MET-06: Woollam V-VASE Ellipsometer
Electrical characterization
Microscopes
- MET-10: Zeiss Smartzoom5 2D/3D Optical Microscope
- MET-12: Zeiss Axio Imager M2m Microscopes (1/4)
- MET-13: Zeiss Axio Imager M2m Microscopes (2/4)
- MET-14: Zeiss Axio Imager M2m Microscopes (3/4)
- MET-15: Zeiss Axio Imager M2m Microscopes (4/4)
Backend & Packaging
- LMM-01: IPG IX-255 Excimer Micromachining Laser
- LMM-02: IPG IX280-DXF Green Micromachining Laser
- BE-01: EVG 510 Wafer Bonder
- BE-02: EVG 620 Wafer Bond Aligner
- BE-03: K&S Wire Bonder
- BE-04: ADT 7100 Dicing Saw
- BE-06: TPT HB100 Wire Bonder
- SPN-07: CEE 200X Spinner
- Dimatix ink-Jet Printer
Thermal Processing
- CVD-02C: Sandvik Anneal Furnace 1
- CVD-02D: Sandvik Anneal Furnace 2
- RTA-01: RTA01
- RTA-02: RTA02