Difference between revisions of "Equipment"

From Quattrone Nanofabrication Facility
Jump to navigation Jump to search
 
Line 7: Line 7:
 
* '''PVD-09:''' [[Intlvac E-beam Evaporator | Intlvac E-beam Evaporator]]
 
* '''PVD-09:''' [[Intlvac E-beam Evaporator | Intlvac E-beam Evaporator]]
  
==== Sputtering ====
+
==== [[PVD Equipment Overview|Sputtering]] ====
 
* '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]]  
 
* '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]]  
 
* '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
 
* '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]

Latest revision as of 09:54, 25 September 2024

Deposition

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Etching

Plasma Etch

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • SPN-07 is listed under Back End Processing
  • SPN-08 is listed under Soft Lithography
  • SPN-09 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing