Difference between revisions of "Equipment"

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* '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]]
 
* '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]]
 
* '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]]
 
* '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]]
* '' '''DE-07''' is listed under Soft Lithography''
+
* '''DE-07:''' [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]] ''- cross-listed under Soft Lithography''
 
* '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]]
 
* '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]]
 
* '''DE-09:''' [[Tergeo-Plus Plasma Cleaner | Tergeo-Plus Plasma Cleaner]]
 
* '''DE-09:''' [[Tergeo-Plus Plasma Cleaner | Tergeo-Plus Plasma Cleaner]]

Revision as of 16:55, 25 July 2025

Deposition

Physical Vapor Deposition (PVD)

PVD Equipment Overview

Evaporation

Sputtering

PVD-07: SCS PDS2010 Parylene Coater is listed under Backend & Packaging
PVD-08: Silanization Dessicator is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Dry Etching

Ion Milling

Plasma Etch

Vapor Etch

Lithography

E-beam Lithography

Photolithography

Imprint Lithography

Soft Lithography

Resist Coating

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing