Difference between revisions of "Equipment"
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* '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]] | * '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]] | ||
| − | ''PVD-07 is listed under Soft Lithography'' | + | '' '''PVD-07''' is listed under Soft Lithography'' <br> |
| + | '' '''PVD-08''' is listed under Soft Lithography'' | ||
== Chemical Vapor Deposition (CVD) == | == Chemical Vapor Deposition (CVD) == | ||
=== Atomic layer deposition (ALD) === | === Atomic layer deposition (ALD) === | ||
* '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]] | * '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]] | ||
| + | * '''ALD-02:''' [[Fiji G2 ALD | Fiji G2 ALD]] | ||
* '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]] | * '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]] | ||
| Line 22: | Line 24: | ||
* '''CVD-02:''' [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]] | * '''CVD-02:''' [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]] | ||
| − | == Etching == | + | == [[How plasma etch works|Etching]] == |
| + | |||
=== Plasma Etch === | === Plasma Etch === | ||
* '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]] | * '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]] | ||
| Line 28: | Line 31: | ||
* '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]] | * '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]] | ||
* '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]] | * '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]] | ||
| + | * '' '''DE-07''' is listed under Soft Lithography'' | ||
* '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] | * '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] | ||
| − | |||
| − | |||
=== Vapor/Wet Etch === | === Vapor/Wet Etch === | ||
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=== Resist Coating === | === Resist Coating === | ||
* '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]] | * '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]] | ||
| − | * '''SPN-01:''' Apogee Spinner - Positive Resist (Left) - No LOR/PMGI/Polyimide | + | * '''SPN-01:''' [[ Apogee Spinner - Positive Resist (Left) | Apogee Spinner - Positive Resist (Left)]] - No LOR/PMGI/Polyimide! |
| − | * '''SPN-03:''' Apogee Spinner - Positive Resist (Right) | + | * '''SPN-03:''' [[ Apogee Spinner - Positive Resist (Right) | Apogee Spinner - Positive Resist (Right)]] |
* '''SPN-04:''' ReynoldsTech Spinner - Negative Resist | * '''SPN-04:''' ReynoldsTech Spinner - Negative Resist | ||
| − | * '''SPN-06:''' Apogee Spinner - E-Beam Resist | + | * '''SPN-06:''' [[ Apogee Spinner - E-Beam Resist | Apogee Spinner - E-Beam Resist]] - No LOR/PMGI/Polyimide! |
| − | ''SPN-07 is listed under Soft Lithography'' | + | * '' '''SPN-07''' is listed under Back End Processing'' <br> |
| + | * '' '''SPN-08''' is listed under Soft Lithography'' <br> | ||
| + | * '' '''SPN-09''' is listed under Soft Lithography'' | ||
=== Soft Lithography === | === Soft Lithography === | ||
| Line 65: | Line 69: | ||
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]] | * '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]] | ||
* '''PVD-08:''' Silanization Dessicator | * '''PVD-08:''' Silanization Dessicator | ||
| − | |||
== Metrology & characterization == | == Metrology & characterization == | ||
| Line 102: | Line 105: | ||
* '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]] | * '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]] | ||
* '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]] | * '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]] | ||
| + | * '''SPN-07:''' [[Spinner - SU-8/PDMS | CEE 200X Spinner]] | ||
* Dimatix ink-Jet Printer | * Dimatix ink-Jet Printer | ||
Revision as of 16:08, 25 March 2024
Physical Vapor Deposition (PVD)
Evaporation
- PVD-01: Lesker Nano-36 Thermal Evaporator
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-04: Lesker PVD75 E-beam Evaporator
Sputtering
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-05: Denton Explorer14 Magnetron Sputterer
PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography
Chemical Vapor Deposition (CVD)
Atomic layer deposition (ALD)
- ALD-01: Cambridge Nanotech S200 ALD
- ALD-02: Fiji G2 ALD
- ALD-03: Veeco Savannah 200
Plasma Enhanced CVD (PECVD)
- CVD-01: Oxford PlasmaLab 100 PECVD
Tube furnace
Etching
Plasma Etch
- DE-02: Anatech SCE-108 Barrel Asher
- DE-03: SPTS Si DRIE
- DE-04: Oxford 80 Plus RIE
- DE-05: Oxford Cobra ICP Etcher
- DE-07 is listed under Soft Lithography
- DE-08: Jupiter II RIE Plasma Etcher
Vapor/Wet Etch
Lithography
E-beam Lithography
- EBL-01: Elionix ELS-7500EX E-Beam Lithography System
- EBL-02: Litho Workstation for BEAMER and TRACER
- EBL-03: Raith EBPG5200+ E-Beam Lithography System
Laser Lithography
Photolithography
Imprint Lithography
- MA-02: Nanonex NX2600 Nanoimprint
Resist Coating
- RC-01: SUSS MicroTec AS8 AltaSpray
- SPN-01: Apogee Spinner - Positive Resist (Left) - No LOR/PMGI/Polyimide!
- SPN-03: Apogee Spinner - Positive Resist (Right)
- SPN-04: ReynoldsTech Spinner - Negative Resist
- SPN-06: Apogee Spinner - E-Beam Resist - No LOR/PMGI/Polyimide!
- SPN-07 is listed under Back End Processing
- SPN-08 is listed under Soft Lithography
- SPN-09 is listed under Soft Lithography
Soft Lithography
- DE-07: Anatech SCE-106 Barrel Asher
- MA-03: ABM3000HR Mask Aligner
- PVD-07: SCS PDS2010 Parylene Coater
- PVD-08: Silanization Dessicator
Metrology & characterization
Stylus profilometers
- MET-01: KLA Tencor P7 2D profilometer
- MET-02: KLA Tencor P7 2D&3D/stress profilometer
Optical profilometers
- MET-05: Filmetrics Profilm3D
Reflectometers
- MET-03: Filmetrics F50 (UV Filter)
- MET-04: Filmetrics F40
- MET-11: Filmetrics F50 (White Light)
Ellipsometer
- MET-06: Woollam V-VASE Ellipsometer
Electrical characterization
- MET-08: Jandel Multi Height Four Point Probe
- MET-09: Micromanipulator 4060 Probe Station
Microscopes
- MET-10: Zeiss Smartzoom5 2D/3D Optical Microscope
- MET-12: Zeiss Axio Imager M2m Microscopes (1/4)
- MET-13: Zeiss Axio Imager M2m Microscopes (2/4)
- MET-14: Zeiss Axio Imager M2m Microscopes (3/4)
- MET-15: Zeiss Axio Imager M2m Microscopes (4/4)
Backend & Packaging
- LMM-01: IPG IX-255 Excimer Micromachining Laser
- LMM-02: IPG IX280-DXF Green Micromachining Laser
- BE-01: EVG 510 Wafer Bonder
- BE-02: EVG 620 Wafer Bond Aligner
- BE-03: K&S Wire Bonder
- BE-04: ADT 7100 Dicing Saw
- BE-06: TPT HB100 Wire Bonder
- SPN-07: CEE 200X Spinner
- Dimatix ink-Jet Printer
Thermal Processing
- CVD-02C: Sandvik Anneal Furnace 1
- CVD-02D: Sandvik Anneal Furnace 2