Difference between revisions of "Equipment"

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* '' '''DE-07''' is listed under Soft Lithography''
 
* '' '''DE-07''' is listed under Soft Lithography''
 
* '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]]
 
* '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]]
 
+
* '''DE-09:''' [[Tergeo-Plus Plasma Cleaner | Tergeo-Plus Plasma Cleaner]]
 
=== Vapor Etch ===
 
=== Vapor Etch ===
 
* '''DE-06:''' [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]]
 
* '''DE-06:''' [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]]

Latest revision as of 13:37, 2 December 2024

Deposition

Physical Vapor Deposition (PVD)

PVD Equipment Overview

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Etching

Plasma Etching Overview

Ion Milling

Plasma Etch

Vapor Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • SPN-07 is listed under Back End Processing
  • SPN-08 is listed under Soft Lithography
  • SPN-09 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing