Difference between revisions of "Equipment"

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* '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]  
 
* '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]  
 
* '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]]
 
* '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]]
* '''PVD-09:''' Intlvac E-beam Evaporator
+
* '''PVD-09:''' [[Intlvac E-beam Evaporator | Intlvac E-beam Evaporator]]
  
 
==== Sputtering ====
 
==== Sputtering ====

Revision as of 10:52, 30 August 2024

Deposition

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Etching

Plasma Etch

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • SPN-07 is listed under Back End Processing
  • SPN-08 is listed under Soft Lithography
  • SPN-09 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing