Difference between revisions of "Equipment"
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==Deposition== | ==Deposition== | ||
=== [[How PVD works|Physical Vapor Deposition (PVD)]] === | === [[How PVD works|Physical Vapor Deposition (PVD)]] === | ||
| + | ''[[PVD Equipment Overview|PVD Equipment Overview]]'' | ||
==== [[PVD Equipment Overview|Evaporation]] ==== | ==== [[PVD Equipment Overview|Evaporation]] ==== | ||
* '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]] | * '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]] | ||
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== Etching == | == Etching == | ||
| − | + | ''[[How plasma etch works|Plasma Etching Overview]]'' | |
| + | |||
| + | === Ion Milling === | ||
* '''DE-01:''' [[IntlVac NanoQuest 1 IBE |IntlVac NanoQuest 1 IBE]] | * '''DE-01:''' [[IntlVac NanoQuest 1 IBE |IntlVac NanoQuest 1 IBE]] | ||
| + | |||
| + | === Plasma Etch === | ||
* '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]] | * '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]] | ||
* '''DE-03:''' [[SPTS Si DRIE | SPTS Si DRIE]] | * '''DE-03:''' [[SPTS Si DRIE | SPTS Si DRIE]] | ||
| Line 34: | Line 39: | ||
* '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] | * '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] | ||
| − | === Vapor | + | === Vapor Etch === |
* '''DE-06:''' [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]] | * '''DE-06:''' [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]] | ||
Latest revision as of 15:43, 4 November 2024
Deposition
Physical Vapor Deposition (PVD)
Evaporation
- PVD-01: Lesker Nano-36 Thermal Evaporator
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-04: Lesker PVD75 E-beam Evaporator
- PVD-09: Intlvac E-beam Evaporator
Sputtering
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-05: Denton Explorer14 Magnetron Sputterer
PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography
Chemical Vapor Deposition (CVD)
- CVD-01: Oxford PlasmaLab 100 PECVD
- CVD-02 (Tube furnaces): Sandvik Furnace Stack - SiO2, SiNx, Anneal tubes
Atomic Layer Deposition (ALD)
- ALD-01: Cambridge Nanotech S200 ALD
- ALD-02: Fiji G2 ALD
- ALD-03: Veeco Savannah 200
Etching
Ion Milling
- DE-01: IntlVac NanoQuest 1 IBE
Plasma Etch
- DE-02: Anatech SCE-108 Barrel Asher
- DE-03: SPTS Si DRIE
- DE-04: Oxford 80 Plus RIE
- DE-05: Oxford Cobra ICP Etcher
- DE-07 is listed under Soft Lithography
- DE-08: Jupiter II RIE Plasma Etcher
Vapor Etch
Lithography
E-beam Lithography
- EBL-01: Elionix ELS-7500EX E-Beam Lithography System
- EBL-02: Litho Workstation for BEAMER and TRACER
- EBL-03: Raith EBPG5200+ E-Beam Lithography System
Laser Lithography
Photolithography
Imprint Lithography
- MA-02: Nanonex NX2600 Nanoimprint
Resist Coating
- RC-01: SUSS MicroTec AS8 AltaSpray
- SPN-01: CEE Apogee Spinner - Acetone Soluble Photoresist
- SPN-03: CEE Apogee Spinner - LOR/PMGI
- SPN-04: ReynoldsTech Spinner - Negative Resist
- SPN-06: CEE Apogee Spinner - E-Beam Resist
- SPN-07 is listed under Back End Processing
- SPN-08 is listed under Soft Lithography
- SPN-09 is listed under Soft Lithography
Soft Lithography
- DE-07: Anatech SCE-106 Barrel Asher
- MA-03: ABM3000HR Mask Aligner
- PVD-07: SCS PDS2010 Parylene Coater
- PVD-08: Silanization Dessicator
- SPN-08: CEE Apogee Spinner - Negative Epoxy
- SPN-09: CEE Apogee Spinner - PDMS
Metrology & characterization
Stylus profilometers
- MET-01: KLA Tencor P7 2D profilometer
- MET-02: KLA Tencor P7 2D&3D/stress profilometer
Optical profilometers
- MET-05: Filmetrics Profilm3D
Reflectometers
- MET-03: Filmetrics F50 (UV Filter)
- MET-04: Filmetrics F40
- MET-11: Filmetrics F50 (White Light)
Ellipsometer
- MET-06: Woollam V-VASE Ellipsometer
Electrical characterization
Microscopes
- MET-10: Zeiss Smartzoom5 2D/3D Optical Microscope
- MET-12: Zeiss Axio Imager M2m Microscopes (1/4)
- MET-13: Zeiss Axio Imager M2m Microscopes (2/4)
- MET-14: Zeiss Axio Imager M2m Microscopes (3/4)
- MET-15: Zeiss Axio Imager M2m Microscopes (4/4)
Backend & Packaging
- LMM-01: IPG IX-255 Excimer Micromachining Laser
- LMM-02: IPG IX280-DXF Green Micromachining Laser
- BE-01: EVG 510 Wafer Bonder
- BE-02: EVG 620 Wafer Bond Aligner
- BE-03: K&S Wire Bonder
- BE-04: ADT 7100 Dicing Saw
- BE-06: TPT HB100 Wire Bonder
- SPN-07: CEE 200X Spinner
- Dimatix ink-Jet Printer
Thermal Processing
- CVD-02C: Sandvik Anneal Furnace 1
- CVD-02D: Sandvik Anneal Furnace 2
- RTA-01: RTA01
- RTA-02: RTA02