Difference between revisions of "Equipment"

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Line 112: Line 112:
 
* '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]]
 
* '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]]
 
* '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]]
 
* '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]]
* '''RTA-01:'''[[RTA01 | RTA01]]
+
* '''RTA-01:'''[[RTA-01 | RTA01]]
 
* '''RTA-02:'''[[RTA02 | RTA02]]
 
* '''RTA-02:'''[[RTA02 | RTA02]]
  

Latest revision as of 13:13, 9 September 2024

Deposition

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Etching

Plasma Etch

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • SPN-07 is listed under Back End Processing
  • SPN-08 is listed under Soft Lithography
  • SPN-09 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing