Difference between revisions of "Equipment"

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== Deposition ==
+
==Deposition==
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===== Evaporation =====
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=== [[How PVD works|Physical Vapor Deposition (PVD)]] ===
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* Lesker Nano-36 Thermal Evaporator
+
''[[PVD Equipment Overview|PVD Equipment Overview]]''
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* Lesker PVD75 E-Beam/Thermal Evaporator  
+
==== [[PVD Equipment Overview|Evaporation]] ====
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* Lesker PVD75 E-beam Evaporator
+
* '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]]
 +
* '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]
 +
* '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]]
 +
* '''PVD-09:''' [[Intlvac E-beam Evaporator | Intlvac E-beam Evaporator]]
  
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===== Sputtering =====
+
==== [[PVD Equipment Overview|Sputtering]] ====
−
* Lesker PVD75 DC/RF Sputterer
+
* '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]]
−
* Denton Explorer14 Magnetron Sputterer  
+
* '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
  
−
===== Chemical Vapor Deposition (CVD) =====
+
'' '''PVD-07''' is listed under Soft Lithography'' <br>
−
* [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
+
'' '''PVD-08''' is listed under Soft Lithography''
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* Veeco Savannah 200
 
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* [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]]
 
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* MRL Wet/Dry Thermal Oxide Furnace
 
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* MRL LPCVD Silicon Nitride Furnace
 
  
−
== Etch ==
+
=== [[What is Chemical Vapor Deposition (CVD)?|Chemical Vapor Deposition (CVD)]] ===
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===== Plasma Etch =====
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* '''CVD-01:''' [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]]
−
* Anatech SCE-108 Barrel Asher
+
* '''CVD-02 (Tube furnaces):''' [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]]
−
* SPTS Si DRIE 
 
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* Oxford 80 Plus RIE
 
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* Oxford Cobra ICP Etcher
 
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* Jupiter II RIE Plasma Etcher
 
  
−
==== Vapor / Wet Etch ====
+
=== [[What is Atomic Layer Deposition?|Atomic Layer Deposition (ALD)]] ===
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* SPTS/Xactix XeF2 Isotropic Etcher
+
* '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
 +
* '''ALD-02:''' [[Fiji G2 ALD | Fiji G2 ALD]]
 +
* '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]]
 +
 
 +
== Etching ==
 +
 
 +
''[[How plasma etch works|Plasma Etching Overview]]''
 +
 
 +
=== Ion Milling ===
 +
* '''DE-01:''' [[IntlVac NanoQuest 1 IBE |IntlVac NanoQuest 1 IBE]]
 +
 
 +
=== Plasma Etch ===
 +
* '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]]
 +
* '''DE-03:''' [[SPTS Si DRIE | SPTS Si DRIE]] 
 +
* '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]]
 +
* '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]]
 +
* '' '''DE-07''' is listed under Soft Lithography''
 +
* '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]]
 +
 
 +
=== Vapor Etch ===
 +
* '''DE-06:''' [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]]
  
 
== Lithography ==
 
== Lithography ==
−
==== E-beam Lithography ====
+
=== E-beam Lithography ===
−
* [[ Elionix ELS-7500EX E-Beam Lithography System | Elionix ELS-7500EX E-Beam Lithography System ]]
+
* '''EBL-01:''' [[ Elionix ELS-7500EX E-Beam Lithography System | Elionix ELS-7500EX E-Beam Lithography System ]]
−
* Litho Workstation for BEAMER and TRACER
+
* '''EBL-02:''' [[Litho Workstation for BEAMER and TRACER | Litho Workstation for BEAMER and TRACER]]
 +
* '''EBL-03:''' [[ Raith EBPG5200+ E-Beam Lithography System | Raith EBPG5200+ E-Beam Lithography System ]]
  
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==== Laser Lithography ====
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=== Laser Lithography ===
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* Heidelberg DWL 66+ Laser Writer
+
* '''LW-01:''' [[Heidelberg DWL 66+ Laser Writer | Heidelberg DWL 66+ Laser Writer]]
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* Nanoscribe Photonic Professional GT
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* '''LW-02:''' [[Nanoscribe Photonic Professional GT | Nanoscribe Photonic Professional GT]]
  
−
==== Photolithography ====
+
=== Photolithography ===
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* SUSS MicroTec MA6 Gen3 Mask Aligner
+
* '''MA-01:''' [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]]
  
−
==== Imprint Lithography ====
+
=== Imprint Lithography ===
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* Nanonex NX2600 Nanoimprint
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* '''MA-02:''' [[Nanonex NX2600 Nanoimprint | Nanonex NX2600 Nanoimprint]]
  
−
==== Resist Coating ====
+
=== Resist Coating ===
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* Spinner - Positive Resist (Left) - 4" Wafer Only
+
* '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]]
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* Spinner - Positive Resist (Right) - Small Piece Only
+
* '''SPN-01:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Acetone Soluble Photoresist]]
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* Spinner - Negative Resist (Left)
+
* '''SPN-03:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - LOR/PMGI]]
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* Spinner - Negative Resist (Right)
+
* '''SPN-04:''' ReynoldsTech Spinner - Negative Resist
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* Spinner - E-Beam Resist Only
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* '''SPN-06:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - E-Beam Resist]]
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* SUSS MicroTec AS8 AltaSpray
 
  
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== Soft Lithography ==
+
* '' '''SPN-07''' is listed under Back End Processing'' <br>
−
* Anatech SCE-106 Barrel Asher
+
* '' '''SPN-08''' is listed under Soft Lithography'' <br>
−
* [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]]
+
* '' '''SPN-09''' is listed under Soft Lithography''
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* SCS PDS2010 Parylene Coater  
+
 
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* Silanization Dessicator
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=== Soft Lithography ===
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* Spinner - SU-8/PDMS
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* '''DE-07:''' [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]]
 +
* '''MA-03:''' [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]]
 +
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
 +
* '''PVD-08:''' Silanization Dessicator
 +
* '''SPN-08:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Negative Epoxy]]
 +
* '''SPN-09:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - PDMS]]
 +
 
 +
== Metrology & characterization ==
 +
=== Stylus profilometers ===
 +
* '''MET-01:''' [[KLA Tencor P7 2D profilometer | KLA Tencor P7 2D profilometer]]
 +
* '''MET-02:''' [[KLA Tencor P7 2D&3D/stress profilometer | KLA Tencor P7 2D&3D/stress profilometer]]
 +
 
 +
=== Optical profilometers ===
 +
* '''MET-05:''' [[Filmetrics Profilm3D | Filmetrics Profilm3D]]
 +
 
 +
=== Reflectometers ===
 +
* '''MET-03:''' [[Filmetrics F50 (UV Filter) | Filmetrics F50 (UV Filter)]]
 +
* '''MET-04:''' [[Filmetrics F40 | Filmetrics F40]]
 +
* '''MET-11:''' [[Filmetrics F50 (White Light) | Filmetrics F50 (White Light)]]
 +
 
 +
=== Ellipsometer ===
 +
* '''MET-06:''' [[Woollam V-VASE Ellipsometer | Woollam V-VASE Ellipsometer]]
 +
 
 +
=== Electrical characterization ===
 +
* '''MET-08:''' [[Jandel Multi Height Four Point Probe | Jandel Multi Height Four Point Probe]]
 +
* '''MET-09:''' [[Micromanipulator 4060 Probe Station | Micromanipulator 4060 Probe Station]]
 +
 
 +
=== Microscopes ===
 +
* '''MET-10:''' Zeiss Smartzoom5 2D/3D Optical Microscope
 +
* '''MET-12:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (1/4)
 +
* '''MET-13:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (2/4)
 +
* '''MET-14:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (3/4)
 +
* '''MET-15:''' [[Zeiss Axio Imager M2m Microscopes | Zeiss Axio Imager M2m Microscopes]] (4/4)
  
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== Metrology ==
 
−
* KLA Tencor P7 2D profilometer
 
−
* KLA Tencor P7 2D&3D/stress profilometer
 
−
* Filmetrics F50 (yellow light)
 
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* Filmetrics F40
 
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* Zygo NewView 7300 Optical Profilometer
 
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* Woollam VAS Ellipsometer
 
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* Jandel Multi Height Four Point Probe
 
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* Micromanipulator 4060 Probe Station
 
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* Filmetrics F50 (white light)
 
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* Zeiss Axio Imager M2m Microscopes
 
−
 
 
== Backend & Packaging ==
 
== Backend & Packaging ==
−
* IPG IX-255 Excimer Micromachining Laser
+
* '''LMM-01:''' [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]]
−
* IPG IX280-DXF Green Micromachining Laser
+
* '''LMM-02:''' [[IPG IX280-DXF Green Micromachining Laser | IPG IX280-DXF Green Micromachining Laser]]
−
* EVG 510 Wafer Bonder
+
* '''BE-01:''' [[EVG 510 Wafer Bonder | EVG 510 Wafer Bonder]]
−
* EVG 620 Wafer Bond Aligner
+
* '''BE-02:''' [[EVG 620 Wafer Bond Aligner | EVG 620 Wafer Bond Aligner]]
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* K&S Wire Bonder
+
* '''BE-03:''' [[K&S Wire Bonder | K&S Wire Bonder]]
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* ADT 7100 Dicing Saw
+
* '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]]
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* Tousimis Critical Point Dryer
+
* '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]]
−
* Dimatix ink-Jet Printer  
+
* '''SPN-07:''' [[Spinner - SU-8/PDMS | CEE 200X Spinner]]
 +
* Dimatix ink-Jet Printer
  
 
== Thermal Processing ==
 
== Thermal Processing ==
−
* MPT Corp. RTP-600S Rapid Thermal Annealer
+
* '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]]
−
* MRL Anneal Furnace 1
+
* '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]]
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* MRL Anneal Furnace 2
+
* '''RTA-01:'''[[RTA-01 | RTA01]]
 +
* '''RTA-02:'''[[RTA02 | RTA02]]
 +
 
 +
== Wet Processing ==
 +
* '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]]
 +
* '''SRD-01:'''[[RENA Compass Dual Stack Spin Rinse Dryer | RENA Compass Dual Stack Spin Rinse Dryer]]

Revision as of 15:43, 4 November 2024

Deposition

Physical Vapor Deposition (PVD)

PVD Equipment Overview

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Etching

Plasma Etching Overview

Ion Milling

Plasma Etch

Vapor Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • SPN-07 is listed under Back End Processing
  • SPN-08 is listed under Soft Lithography
  • SPN-09 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing

Retrieved from "https://wiki.nano.upenn.edu/wiki/index.php?title=Equipment&oldid=2097"