Difference between revisions of "Equipment"

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* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
 
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
 
* '''PVD-08:''' Silanization Dessicator
 
* '''PVD-08:''' Silanization Dessicator
* '''SPN-08:''' [[ CEE Apogee Spinner | Apogee Spinner - Negative Epoxy]]
+
* '''SPN-08:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - Negative Epoxy]]
* '''SPN-09:''' [[ CEE Apogee Spinner | Apogee Spinner - PDMS]]
+
* '''SPN-09:''' [[ CEE Apogee Spinner | CEE Apogee Spinner - PDMS]]
  
 
== Metrology & characterization ==
 
== Metrology & characterization ==

Revision as of 16:49, 18 June 2024

Deposition

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Etching

Plasma Etch

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • SPN-07 is listed under Back End Processing
  • SPN-08 is listed under Soft Lithography
  • SPN-09 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing