Difference between revisions of "Equipment"

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=== Electrical characterization ===
 
=== Electrical characterization ===
 
* '''MET-08:''' [[Jandel Multi Height Four Point Probe | Jandel Multi Height Four Point Probe]]
 
* '''MET-08:''' [[Jandel Multi Height Four Point Probe | Jandel Multi Height Four Point Probe]]
* '''MET-09:''' Micromanipulator 4060 Probe Station
+
* '''MET-09:''' [[Micromanipulator 4060 Probe Station | Micromanipulator 4060 Probe Station]]
  
 
=== Microscopes ===
 
=== Microscopes ===

Revision as of 15:59, 25 April 2024

Deposition

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic Layer Deposition (ALD)

Etching

Plasma Etch

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • SPN-07 is listed under Back End Processing
  • SPN-08 is listed under Soft Lithography
  • SPN-09 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing