Difference between revisions of "Equipment"

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=== Atomic layer deposition (ALD) ===
 
=== Atomic layer deposition (ALD) ===
 
* '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
 
* '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
 +
* '''ALD-02:''' [[Fiji G2 ALD | Fiji G2 ALD]]
 
* '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]]
 
* '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]]
  

Revision as of 09:35, 20 March 2024

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic layer deposition (ALD)

Plasma Enhanced CVD (PECVD)

Tube furnace

Etching

Plasma Etch

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • SPN-07 is listed under Back End Processing
  • SPN-08 is listed under Soft Lithography
  • SPN-09 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing