Difference between revisions of "Equipment"
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* '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]] | * '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]] | ||
* '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]] | * '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]] | ||
| − | |||
* Dimatix ink-Jet Printer | * Dimatix ink-Jet Printer | ||
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* '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]] | * '''CVD-02C:''' [[Sandvik Furnace Stack | Sandvik Anneal Furnace 1]] | ||
* '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]] | * '''CVD-02D:'''[[Sandvik Furnace Stack | Sandvik Anneal Furnace 2]] | ||
| + | * '''SRD-01:'''[[RENA Compass Dual Stack Spin Rinse Dryer | RENA Compass Dual Stack Spin Rinse Dryer]] | ||
| + | |||
| + | == Wet Processing == | ||
| + | * '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]] | ||
* '''SRD-01:'''[[RENA Compass Dual Stack Spin Rinse Dryer | RENA Compass Dual Stack Spin Rinse Dryer]] | * '''SRD-01:'''[[RENA Compass Dual Stack Spin Rinse Dryer | RENA Compass Dual Stack Spin Rinse Dryer]] | ||
Revision as of 11:09, 24 May 2023
Physical Vapor Deposition (PVD)
Evaporation
- PVD-01: Lesker Nano-36 Thermal Evaporator
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-04: Lesker PVD75 E-beam Evaporator
Sputtering
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-05: Denton Explorer14 Magnetron Sputterer
PVD-07 is listed under Soft Lithography
Chemical Vapor Deposition (CVD)
Atomic layer deposition (ALD)
- ALD-01: Cambridge Nanotech S200 ALD
- ALD-03: Veeco Savannah 200
Plasma Enhanced CVD (PECVD)
- CVD-01: Oxford PlasmaLab 100 PECVD
Tube furnace
Etching
Plasma Etch
- DE-02: Anatech SCE-108 Barrel Asher
- DE-03: SPTS Si DRIE
- DE-04: Oxford 80 Plus RIE
- DE-05: Oxford Cobra ICP Etcher
- DE-08: Jupiter II RIE Plasma Etcher
Vapor/Wet Etch
Lithography
E-beam Lithography
- EBL-01: Elionix ELS-7500EX E-Beam Lithography System
- EBL-02: Litho Workstation for BEAMER and TRACER
Laser Lithography
Photolithography
Imprint Lithography
- MA-02: Nanonex NX2600 Nanoimprint
Resist Coating
- RC-01: SUSS MicroTec AS8 AltaSpray
- SPN-01: Spinner - Positive Resist (Left) - Polos
- SPN-03: Spinner - Positive Resist (Right)
- SPN-04: Spinner - Negative Resist (Left)
- SPN-05: Spinner - Negative Resist (Right)
- SPN-06: Spinner - E-Beam Resist Only
SPN-07 is listed under Soft Lithography
Soft Lithography
- SCE-106: Anatech SCE-106 Barrel Asher
- MA-03: ABM3000HR Mask Aligner
- PVD-07: SCS PDS2010 Parylene Coater
- Silanization Dessicator
- SPN-07: Spinner - SU-8/PDMS
Metrology & characterization
Stylus profilometers
- MET-01: KLA Tencor P7 2D profilometer
- MET-02: KLA Tencor P7 2D&3D/stress profilometer
Optical profilometers
- MET-05: Filmetrics Profilm3D
- MET-XX: Zygo NewView 7300 Optical Profilometer
Reflectometers
- MET-03: Filmetrics F50 (UV Filter)
- MET-04: Filmetrics F40
- MET-11: Filmetrics F50 (White Light)
Ellipsometer
- MET-06: Woollam V-VASE Ellipsometer
Electrical characterization
- MET-08: Jandel Multi Height Four Point Probe
- MET-09: Micromanipulator 4060 Probe Station
Microscopes
- MET-10: Zeiss Smartzoom5 2D/3D Optical Microscope
- MET-12: Zeiss Axio Imager M2m Microscopes (1/4)
- MET-13: Zeiss Axio Imager M2m Microscopes (2/4)
- MET-14: Zeiss Axio Imager M2m Microscopes (3/4)
- MET-15: Zeiss Axio Imager M2m Microscopes (4/4)
Backend & Packaging
- LMM-01: IPG IX-255 Excimer Micromachining Laser
- LMM-02: IPG IX280-DXF Green Micromachining Laser
- BE-01: EVG 510 Wafer Bonder
- BE-02: EVG 620 Wafer Bond Aligner
- BE-03: K&S Wire Bonder
- BE-04: ADT 7100 Dicing Saw
- BE-06: TPT HB100 Wire Bonder
- Dimatix ink-Jet Printer
Thermal Processing
- CVD-02C: Sandvik Anneal Furnace 1
- CVD-02D: Sandvik Anneal Furnace 2
- SRD-01: RENA Compass Dual Stack Spin Rinse Dryer