Difference between revisions of "Equipment"

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m (→‎Plasma Etch: Added DE-07 note)
m (→‎Soft Lithography: Corrected DE-07 label)
Line 61: Line 61:
  
 
=== Soft Lithography ===
 
=== Soft Lithography ===
* '''SCE-106:''' [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]]
+
* '''DE-07:''' [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]]
 
* '''MA-03:''' [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]]
 
* '''MA-03:''' [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]]
 
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
 
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]

Revision as of 12:41, 5 October 2023

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic layer deposition (ALD)

Plasma Enhanced CVD (PECVD)

Tube furnace

Etching

Plasma Etch

DE-07 is listed under Soft Lithography

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

SPN-07 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing