Difference between revisions of "Equipment"

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===== Sputtering =====
 
===== Sputtering =====
−
* [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]]
+
* [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]] (PVD-03)
−
* [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
+
* [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]] (PVD-05)
  
 
===== Chemical Vapor Deposition (CVD) =====
 
===== Chemical Vapor Deposition (CVD) =====

Revision as of 10:37, 8 July 2022

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)

Etch

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing

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