Difference between revisions of "Equipment"

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(→‎Soft Lithography: Remove SPN-07)
(→‎Backend & Packaging: Update SPN-07 location)
Line 101: Line 101:
 
* '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]]
 
* '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]]
 
* '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]]
 
* '''BE-06:''' [[TPT HB100 Wire Bonder | TPT HB100 Wire Bonder]]
 +
* '''SPN-07:''' [[Spinner - SU-8/PDMS | CEE 200X Spinner]]
 
* Dimatix ink-Jet Printer
 
* Dimatix ink-Jet Printer
  

Revision as of 14:56, 12 March 2024

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic layer deposition (ALD)

Plasma Enhanced CVD (PECVD)

Tube furnace

Etching

Plasma Etch

DE-07 is listed under Soft Lithography

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

SPN-07 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing