Difference between revisions of "Equipment"

From Quattrone Nanofabrication Facility
Jump to navigation Jump to search
(→‎Resist Coating: Update to current spinners)
Line 58: Line 58:
 
* '''SPN-06:''' [[ Apogee Spinner - E-Beam Resist | Apogee Spinner - E-Beam Resist]] - No LOR/PMGI/Polyimide!
 
* '''SPN-06:''' [[ Apogee Spinner - E-Beam Resist | Apogee Spinner - E-Beam Resist]] - No LOR/PMGI/Polyimide!
  
''SPN-07 is listed under Back End''
+
* '' SPN-07 is listed under Back End Processing'' <br>
''SPN-08 is listed under Soft Lithography''
+
* '' SPN-08 is listed under Soft Lithography'' <br>
''SPN-09 is listed under Soft Lithography''
+
* '' SPN-09 is listed under Soft Lithography''
  
 
=== Soft Lithography ===
 
=== Soft Lithography ===

Revision as of 15:30, 12 March 2024

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic layer deposition (ALD)

Plasma Enhanced CVD (PECVD)

Tube furnace

Etching

Plasma Etch

DE-07 is listed under Soft Lithography

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • SPN-07 is listed under Back End Processing
  • SPN-08 is listed under Soft Lithography
  • SPN-09 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing