Difference between revisions of "Equipment"

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== Physical Vapor Deposition (PVD) ==
 
== Physical Vapor Deposition (PVD) ==
 
===== Evaporation =====
 
===== Evaporation =====
* PVD-01: [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]]  
+
* '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]]  
* PVD-02: [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]  
+
* '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]  
* PVD-04: [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]]
+
* '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]]
  
 
===== Sputtering =====
 
===== Sputtering =====
* PVD-03: [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]]  
+
* '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]]  
* PVD-05: [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
+
* '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
  
 
''PVD-07 is listed under Soft Lithography''
 
''PVD-07 is listed under Soft Lithography''

Revision as of 12:32, 8 July 2022

Physical Vapor Deposition (PVD)

Evaporation
Sputtering

PVD-07 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Etching

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • RC-01: SUSS MicroTec AS8 AltaSpray
  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing