Difference between revisions of "Equipment"

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== Soft Lithography ==
 
== Soft Lithography ==
 
* SCE-106: [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]]
 
* SCE-106: [[Anatech SCE-106 Barrel Asher | Anatech SCE-106 Barrel Asher]]
* MA-01: [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]]
+
* MA-03: [[ABM3000HR Mask Aligner | ABM3000HR Mask Aligner]]
 
* PVD-07: [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
 
* PVD-07: [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
 
* Silanization Dessicator
 
* Silanization Dessicator

Revision as of 12:25, 8 July 2022

Physical Vapor Deposition (PVD)

Evaporation
Sputtering

Chemical Vapor Deposition (CVD)

Etching

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • RC-01: SUSS MicroTec AS8 AltaSpray
  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing