Difference between revisions of "Equipment"

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==== Photolithography ====
 
==== Photolithography ====
* [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]]
+
* MA-01: [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]]
  
 
==== Imprint Lithography ====
 
==== Imprint Lithography ====

Revision as of 12:22, 8 July 2022

Physical vapor deposition (PVD)

Evaporation
Sputtering

Chemical vapor deposition (CVD)

Etching

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • RC-01: SUSS MicroTec AS8 AltaSpray
  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing