Difference between revisions of "Equipment"

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==== Resist Coating ====
 
==== Resist Coating ====
 +
* RC-01: [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]]
 
* Spinner - Positive Resist (Left) - 4" Wafer Only
 
* Spinner - Positive Resist (Left) - 4" Wafer Only
 
* Spinner - Positive Resist (Right) - Small Piece Only
 
* Spinner - Positive Resist (Right) - Small Piece Only
Line 48: Line 49:
 
* Spinner - Negative Resist (Right)
 
* Spinner - Negative Resist (Right)
 
* Spinner - E-Beam Resist Only
 
* Spinner - E-Beam Resist Only
* [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]]
 
  
 
== Soft Lithography ==
 
== Soft Lithography ==

Revision as of 12:21, 8 July 2022

Physical vapor deposition (PVD)

Evaporation
Sputtering

Chemical vapor deposition (CVD)

Etching

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • RC-01: SUSS MicroTec AS8 AltaSpray
  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing