Difference between revisions of "Equipment"

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===== Sputtering =====
 
===== Sputtering =====
−
* (PVD-03) [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]]  
+
* PVD-03: [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]]  
−
* (PVD-05) [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]  
+
* PVD-05: [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]]
  
 
== Chemical vapor deposition (CVD) ==
 
== Chemical vapor deposition (CVD) ==

Revision as of 12:15, 8 July 2022

Physical vapor deposition (PVD)

Evaporation
Sputtering

Chemical vapor deposition (CVD)

Etching

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing

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