Difference between revisions of "Equipment"

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== Physical vapor deposition (PVD) ==
 
== Physical vapor deposition (PVD) ==
 
===== Evaporation =====
 
===== Evaporation =====
* (PVD-01) [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]]  
+
* PVD-01: [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]]  
* (PVD-02) [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]  
+
* PVD-02: [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]  
* (PVD-04) [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]]  
+
* PVD-04: [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]]
  
 
===== Sputtering =====
 
===== Sputtering =====

Revision as of 12:15, 8 July 2022

Physical vapor deposition (PVD)

Evaporation
Sputtering

Chemical vapor deposition (CVD)

Etching

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing