Difference between revisions of "Equipment"

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==== Resist Coating ====
 
==== Resist Coating ====
 
* '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]]
 
* '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]]
* Spinner - Positive Resist (Left) - 4" Wafer Only
+
* '''SPN-01:''' Spinner - Positive Resist (Left) - 4" Wafer Only
* Spinner - Positive Resist (Right) - Small Piece Only
+
* '''SPN-03:''' Spinner - Positive Resist (Right) - Small Piece Only
* Spinner - Negative Resist (Left)
+
* '''SPN-04:''' Spinner - Negative Resist (Left)
* Spinner - Negative Resist (Right)
+
* '''SPN-05:''' Spinner - Negative Resist (Right)
* Spinner - E-Beam Resist Only
+
* '''SPN-06:''' Spinner - E-Beam Resist Only
 +
* '''SPN-07:''' Spinner - SU-8/PDMS
  
 
== Soft Lithography ==
 
== Soft Lithography ==

Revision as of 12:45, 8 July 2022

Physical Vapor Deposition (PVD)

Evaporation
Sputtering

PVD-07 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic layer deposition (ALD)
Plasma Enhanced CVD (PECVD)
Tube furnace

Etching

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • RC-01: SUSS MicroTec AS8 AltaSpray
  • SPN-01: Spinner - Positive Resist (Left) - 4" Wafer Only
  • SPN-03: Spinner - Positive Resist (Right) - Small Piece Only
  • SPN-04: Spinner - Negative Resist (Left)
  • SPN-05: Spinner - Negative Resist (Right)
  • SPN-06: Spinner - E-Beam Resist Only
  • SPN-07: Spinner - SU-8/PDMS

Soft Lithography

Metrology & characterization

Backend & Packaging

Thermal Processing