Difference between revisions of "Equipment"

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== Physical Vapor Deposition (PVD) ==
 
== Physical Vapor Deposition (PVD) ==
===== Evaporation =====
+
=== Evaporation ===
 
* '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]]  
 
* '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]]  
 
* '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]  
 
* '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]  

Revision as of 12:52, 8 July 2022

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic layer deposition (ALD)
Plasma Enhanced CVD (PECVD)
Tube furnace

Etching

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • RC-01: SUSS MicroTec AS8 AltaSpray
  • SPN-01: Spinner - Positive Resist (Left) - 4" Wafer Only
  • SPN-03: Spinner - Positive Resist (Right) - Small Piece Only
  • SPN-04: Spinner - Negative Resist (Left)
  • SPN-05: Spinner - Negative Resist (Right)
  • SPN-06: Spinner - E-Beam Resist Only

SPN-07 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Backend & Packaging

Thermal Processing