Difference between revisions of "Equipment"
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== Backend & Packaging == | == Backend & Packaging == | ||
| − | * [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]] | + | * '''LMM-01:''' [[IPG IX-255 Excimer Micromachining Laser | IPG IX-255 Excimer Micromachining Laser]] |
| − | * [[IPG IX280-DXF Green Micromachining Laser | IPG IX280-DXF Green Micromachining Laser]] | + | * '''LMM-02:''' [[IPG IX280-DXF Green Micromachining Laser | IPG IX280-DXF Green Micromachining Laser]] |
| − | * [[EVG 510 Wafer Bonder | EVG 510 Wafer Bonder]] | + | * '''BE-01:''' [[EVG 510 Wafer Bonder | EVG 510 Wafer Bonder]] |
| − | * [[EVG 620 Wafer Bond Aligner | EVG 620 Wafer Bond Aligner]] | + | * '''BE-02:''' [[EVG 620 Wafer Bond Aligner | EVG 620 Wafer Bond Aligner]] |
| − | * [[K&S Wire Bonder | K&S Wire Bonder]] | + | * '''BE-03:''' [[K&S Wire Bonder | K&S Wire Bonder]] |
| − | * [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]] | + | * '''BE-04:''' [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]] |
| − | * [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]] | + | * '''CPD-01:''' [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]] |
| − | * Dimatix ink-Jet Printer | + | * Dimatix ink-Jet Printer |
== Thermal Processing == | == Thermal Processing == | ||
Revision as of 12:40, 8 July 2022
Physical Vapor Deposition (PVD)
Evaporation
- PVD-01: Lesker Nano-36 Thermal Evaporator
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-04: Lesker PVD75 E-beam Evaporator
Sputtering
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-05: Denton Explorer14 Magnetron Sputterer
PVD-07 is listed under Soft Lithography
Chemical Vapor Deposition (CVD)
Atomic layer deposition (ALD)
- ALD-01: Cambridge Nanotech S200 ALD
- ALD-03: Veeco Savannah 200
Plasma Enhanced CVD (PECVD)
- CVD-01: Oxford PlasmaLab 100 PECVD
Tube furnace
Etching
Plasma Etch
- DE-02: Anatech SCE-108 Barrel Asher
- DE-03: SPTS Si DRIE
- DE-04: Oxford 80 Plus RIE
- DE-05: Oxford Cobra ICP Etcher
- DE-08: Jupiter II RIE Plasma Etcher
Vapor / Wet Etch
Lithography
E-beam Lithography
- EBL-01: Elionix ELS-7500EX E-Beam Lithography System
- EBL-02: Litho Workstation for BEAMER and TRACER
Laser Lithography
Photolithography
Imprint Lithography
- MA-02: Nanonex NX2600 Nanoimprint
Resist Coating
- RC-01: SUSS MicroTec AS8 AltaSpray
- Spinner - Positive Resist (Left) - 4" Wafer Only
- Spinner - Positive Resist (Right) - Small Piece Only
- Spinner - Negative Resist (Left)
- Spinner - Negative Resist (Right)
- Spinner - E-Beam Resist Only
Soft Lithography
- SCE-106: Anatech SCE-106 Barrel Asher
- MA-03: ABM3000HR Mask Aligner
- PVD-07: SCS PDS2010 Parylene Coater
- Silanization Dessicator
- Spinner - SU-8/PDMS
Metrology & characterization
- MET-01: KLA Tencor P7 2D profilometer
- MET-02: KLA Tencor P7 2D&3D/stress profilometer
- MET-03: Filmetrics F50 (UV Filter)
- MET-11: Filmetrics F50 (White Light)
- MET-04: Filmetrics F40
- MET-05: Zygo NewView 7300 Optical Profilometer
- MET-06: Woollam V-VASE Ellipsometer
- MET-08: Jandel Multi Height Four Point Probe
- MET-12/13/14/15: Zeiss Axio Imager M2m Microscopes
- Micromanipulator 4060 Probe Station
Backend & Packaging
- LMM-01: IPG IX-255 Excimer Micromachining Laser
- LMM-02: IPG IX280-DXF Green Micromachining Laser
- BE-01: EVG 510 Wafer Bonder
- BE-02: EVG 620 Wafer Bond Aligner
- BE-03: K&S Wire Bonder
- BE-04: ADT 7100 Dicing Saw
- CPD-01: Tousimis Critical Point Dryer
- Dimatix ink-Jet Printer