Difference between revisions of "Equipment"

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== Chemical Vapor Deposition (CVD) ==
 
== Chemical Vapor Deposition (CVD) ==
 
+
===== Atomic layer deposition (ALD) =====
 
* '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
 
* '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
 
* '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]]
 
* '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]]
 +
 +
===== Plasma Enhanced CVD (PECVD) =====
 
* '''CVD-01:''' [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]]
 
* '''CVD-01:''' [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]]
 +
 +
===== Tube furnace =====
 
* '''CVD-02:''' [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]]
 
* '''CVD-02:''' [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]]
  

Revision as of 12:37, 8 July 2022

Physical Vapor Deposition (PVD)

Evaporation
Sputtering

PVD-07 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic layer deposition (ALD)
Plasma Enhanced CVD (PECVD)
Tube furnace

Etching

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • RC-01: SUSS MicroTec AS8 AltaSpray
  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only

Soft Lithography

Metrology & characterization

Backend & Packaging

Thermal Processing