Difference between revisions of "Equipment"

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* Spinner - SU-8/PDMS
 
* Spinner - SU-8/PDMS
  
== Metrology ==
+
== Metrology & characterization ==
 
* '''MET-01:''' [[KLA Tencor P7 2D profilometer | KLA Tencor P7 2D profilometer]]
 
* '''MET-01:''' [[KLA Tencor P7 2D profilometer | KLA Tencor P7 2D profilometer]]
 
* '''MET-02:''' [[KLA Tencor P7 2D&3D/stress profilometer | KLA Tencor P7 2D&3D/stress profilometer]]
 
* '''MET-02:''' [[KLA Tencor P7 2D&3D/stress profilometer | KLA Tencor P7 2D&3D/stress profilometer]]

Revision as of 12:34, 8 July 2022

Physical Vapor Deposition (PVD)

Evaporation
Sputtering

PVD-07 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Etching

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • RC-01: SUSS MicroTec AS8 AltaSpray
  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only

Soft Lithography

Metrology & characterization

Backend & Packaging

Thermal Processing