Difference between revisions of "Equipment"
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== Etching == | == Etching == | ||
===== Plasma Etch ===== | ===== Plasma Etch ===== | ||
| − | * DE-02: [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]] | + | * '''DE-02:''' [[Anatech SCE-108 Barrel Asher |Anatech SCE-108 Barrel Asher]] |
| − | * DE-03: [[SPTS Si DRIE | SPTS Si DRIE]] | + | * '''DE-03:''' [[SPTS Si DRIE | SPTS Si DRIE]] |
| − | * DE-04: [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]] | + | * '''DE-04:''' [[Oxford 80 Plus RIE | Oxford 80 Plus RIE]] |
| − | * DE-05: [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]] | + | * '''DE-05:''' [[Oxford Cobra ICP Etcher | Oxford Cobra ICP Etcher]] |
| − | * DE-08: [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] | + | * '''DE-08:''' [[Jupiter II RIE Plasma Etcher | Jupiter II RIE Plasma Etcher]] |
==== Vapor / Wet Etch ==== | ==== Vapor / Wet Etch ==== | ||
| − | * DE-06: [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]] | + | * '''DE-06:''' [[SPTS/Xactix XeF2 Isotropic Etcher | SPTS/Xactix XeF2 Isotropic Etcher]] |
== Lithography == | == Lithography == | ||
Revision as of 12:33, 8 July 2022
Physical Vapor Deposition (PVD)
Evaporation
- PVD-01: Lesker Nano-36 Thermal Evaporator
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-04: Lesker PVD75 E-beam Evaporator
Sputtering
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-05: Denton Explorer14 Magnetron Sputterer
PVD-07 is listed under Soft Lithography
Chemical Vapor Deposition (CVD)
- ALD-01: Cambridge Nanotech S200 ALD
- ALD-03: Veeco Savannah 200
- CVD-01: Oxford PlasmaLab 100 PECVD
- CVD-02: Sandvik Furnace Stack - SiO2, SiNx, Anneal tubes
Etching
Plasma Etch
- DE-02: Anatech SCE-108 Barrel Asher
- DE-03: SPTS Si DRIE
- DE-04: Oxford 80 Plus RIE
- DE-05: Oxford Cobra ICP Etcher
- DE-08: Jupiter II RIE Plasma Etcher
Vapor / Wet Etch
Lithography
E-beam Lithography
- EBL-01: Elionix ELS-7500EX E-Beam Lithography System
- EBL-02: Litho Workstation for BEAMER and TRACER
Laser Lithography
Photolithography
Imprint Lithography
- MA-02: Nanonex NX2600 Nanoimprint
Resist Coating
- RC-01: SUSS MicroTec AS8 AltaSpray
- Spinner - Positive Resist (Left) - 4" Wafer Only
- Spinner - Positive Resist (Right) - Small Piece Only
- Spinner - Negative Resist (Left)
- Spinner - Negative Resist (Right)
- Spinner - E-Beam Resist Only
Soft Lithography
- SCE-106: Anatech SCE-106 Barrel Asher
- MA-03: ABM3000HR Mask Aligner
- PVD-07: SCS PDS2010 Parylene Coater
- Silanization Dessicator
- Spinner - SU-8/PDMS
Metrology
- MET-01: KLA Tencor P7 2D profilometer
- MET-02: KLA Tencor P7 2D&3D/stress profilometer
- MET-03: Filmetrics F50 (UV Filter)
- MET-11: Filmetrics F50 (White Light)
- MET-04: Filmetrics F40
- MET-05: Zygo NewView 7300 Optical Profilometer
- MET-06: Woollam V-VASE Ellipsometer
- MET-08: Jandel Multi Height Four Point Probe
- MET-12/13/14/15: Zeiss Axio Imager M2m Microscopes
- Micromanipulator 4060 Probe Station
Backend & Packaging
- IPG IX-255 Excimer Micromachining Laser
- IPG IX280-DXF Green Micromachining Laser
- EVG 510 Wafer Bonder
- EVG 620 Wafer Bond Aligner
- K&S Wire Bonder
- ADT 7100 Dicing Saw
- Tousimis Critical Point Dryer
- Dimatix ink-Jet Printer