Difference between revisions of "Equipment"

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* [[Veeco Savannah 200 | Veeco Savannah 200]]
 
* [[Veeco Savannah 200 | Veeco Savannah 200]]
 
* [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]]
 
* [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]]
−
* [[Sandvik Furnace Stack | Sandvik Furnace Stack]]
+
* [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]]
  
 
== Etch ==
 
== Etch ==

Revision as of 13:42, 5 May 2022

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)

Etch

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing

Retrieved from "https://wiki.nano.upenn.edu/wiki/index.php?title=Equipment&oldid=495"