Difference between revisions of "Equipment"
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| − | == [[How PVD works|PVD]] == | + | ==Deposition== |
| − | === Evaporation === | + | === [[How PVD works|Physical Vapor Deposition (PVD)]] === |
| + | ==== Evaporation ==== | ||
* '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]] | * '''PVD-01:''' [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]] | ||
* '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]] | * '''PVD-02:''' [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]] | ||
* '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]] | * '''PVD-04:''' [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]] | ||
| − | === Sputtering === | + | ==== Sputtering ==== |
* '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]] | * '''PVD-03:''' [[Lesker PVD75 DC/RF Sputterer | Lesker PVD75 DC/RF Sputterer]] | ||
* '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]] | * '''PVD-05:''' [[Denton Explorer14 Magnetron Sputterer | Denton Explorer14 Magnetron Sputterer]] | ||
| Line 13: | Line 14: | ||
=== [[What is Chemical Vapor Deposition (CVD)?|Chemical Vapor Deposition (CVD)]] === | === [[What is Chemical Vapor Deposition (CVD)?|Chemical Vapor Deposition (CVD)]] === | ||
| − | === [[What is Atomic Layer Deposition?|Atomic Layer Deposition (ALD)]] === | + | ==== [[What is Atomic Layer Deposition?|Atomic Layer Deposition (ALD)]] ==== |
* '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]] | * '''ALD-01:''' [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]] | ||
* '''ALD-02:''' [[Fiji G2 ALD | Fiji G2 ALD]] | * '''ALD-02:''' [[Fiji G2 ALD | Fiji G2 ALD]] | ||
* '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]] | * '''ALD-03:''' [[Veeco Savannah 200 | Veeco Savannah 200]] | ||
| − | === Plasma Enhanced CVD (PECVD) === | + | ==== Plasma Enhanced CVD (PECVD) ==== |
* '''CVD-01:''' [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]] | * '''CVD-01:''' [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]] | ||
| − | === Tube furnace === | + | ==== Tube furnace ==== |
* '''CVD-02:''' [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]] | * '''CVD-02:''' [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]] | ||
Revision as of 12:28, 5 April 2024
Deposition
Physical Vapor Deposition (PVD)
Evaporation
- PVD-01: Lesker Nano-36 Thermal Evaporator
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-04: Lesker PVD75 E-beam Evaporator
Sputtering
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-05: Denton Explorer14 Magnetron Sputterer
PVD-07 is listed under Soft Lithography
PVD-08 is listed under Soft Lithography
Chemical Vapor Deposition (CVD)
Atomic Layer Deposition (ALD)
- ALD-01: Cambridge Nanotech S200 ALD
- ALD-02: Fiji G2 ALD
- ALD-03: Veeco Savannah 200
Plasma Enhanced CVD (PECVD)
- CVD-01: Oxford PlasmaLab 100 PECVD
Tube furnace
Etching
Plasma Etch
- DE-02: Anatech SCE-108 Barrel Asher
- DE-03: SPTS Si DRIE
- DE-04: Oxford 80 Plus RIE
- DE-05: Oxford Cobra ICP Etcher
- DE-07 is listed under Soft Lithography
- DE-08: Jupiter II RIE Plasma Etcher
Vapor/Wet Etch
Lithography
E-beam Lithography
- EBL-01: Elionix ELS-7500EX E-Beam Lithography System
- EBL-02: Litho Workstation for BEAMER and TRACER
- EBL-03: Raith EBPG5200+ E-Beam Lithography System
Laser Lithography
Photolithography
Imprint Lithography
- MA-02: Nanonex NX2600 Nanoimprint
Resist Coating
- RC-01: SUSS MicroTec AS8 AltaSpray
- SPN-01: Apogee Spinner - Positive Resist (Left) - No LOR/PMGI/Polyimide!
- SPN-03: Apogee Spinner - Positive Resist (Right)
- SPN-04: ReynoldsTech Spinner - Negative Resist
- SPN-06: Apogee Spinner - E-Beam Resist - No LOR/PMGI/Polyimide!
- SPN-07 is listed under Back End Processing
- SPN-08 is listed under Soft Lithography
- SPN-09 is listed under Soft Lithography
Soft Lithography
- DE-07: Anatech SCE-106 Barrel Asher
- MA-03: ABM3000HR Mask Aligner
- PVD-07: SCS PDS2010 Parylene Coater
- PVD-08: Silanization Dessicator
Metrology & characterization
Stylus profilometers
- MET-01: KLA Tencor P7 2D profilometer
- MET-02: KLA Tencor P7 2D&3D/stress profilometer
Optical profilometers
- MET-05: Filmetrics Profilm3D
Reflectometers
- MET-03: Filmetrics F50 (UV Filter)
- MET-04: Filmetrics F40
- MET-11: Filmetrics F50 (White Light)
Ellipsometer
- MET-06: Woollam V-VASE Ellipsometer
Electrical characterization
- MET-08: Jandel Multi Height Four Point Probe
- MET-09: Micromanipulator 4060 Probe Station
Microscopes
- MET-10: Zeiss Smartzoom5 2D/3D Optical Microscope
- MET-12: Zeiss Axio Imager M2m Microscopes (1/4)
- MET-13: Zeiss Axio Imager M2m Microscopes (2/4)
- MET-14: Zeiss Axio Imager M2m Microscopes (3/4)
- MET-15: Zeiss Axio Imager M2m Microscopes (4/4)
Backend & Packaging
- LMM-01: IPG IX-255 Excimer Micromachining Laser
- LMM-02: IPG IX280-DXF Green Micromachining Laser
- BE-01: EVG 510 Wafer Bonder
- BE-02: EVG 620 Wafer Bond Aligner
- BE-03: K&S Wire Bonder
- BE-04: ADT 7100 Dicing Saw
- BE-06: TPT HB100 Wire Bonder
- SPN-07: CEE 200X Spinner
- Dimatix ink-Jet Printer
Thermal Processing
- CVD-02C: Sandvik Anneal Furnace 1
- CVD-02D: Sandvik Anneal Furnace 2