Difference between revisions of "Equipment"

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* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
 
* '''PVD-07:''' [[SCS PDS2010 Parylene Coater| SCS PDS2010 Parylene Coater]]
 
* '''PVD-08:''' Silanization Dessicator
 
* '''PVD-08:''' Silanization Dessicator
* '''SPN-07:''' [[Spinner - SU-8/PDMS | Spinner - SU-8/PDMS]]
+
* '''SPN-07:''' [[CEE Spinner - SU-8/PDMS | CEE Spinner - SU-8/PDMS]]
  
 
== Metrology & characterization ==
 
== Metrology & characterization ==

Revision as of 13:16, 3 January 2024

Physical Vapor Deposition (PVD)

Evaporation

Sputtering

PVD-07 is listed under Soft Lithography

Chemical Vapor Deposition (CVD)

Atomic layer deposition (ALD)

Plasma Enhanced CVD (PECVD)

Tube furnace

Etching

Plasma Etch

DE-07 is listed under Soft Lithography

Vapor/Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • RC-01: SUSS MicroTec AS8 AltaSpray
  • SPN-01: Apogee Spinner - Positive Resist (Left) - No LOR/PMGI/Polyimide
  • SPN-03: Apogee Spinner - Positive Resist (Right)
  • SPN-04: ReynoldsTech Spinner - Negative Resist
  • SPN-06: Apogee Spinner - E-Beam Resist Only - No LOR/PMGI/Polyimide

SPN-07 is listed under Soft Lithography

Soft Lithography

Metrology & characterization

Stylus profilometers

Optical profilometers

Reflectometers

Ellipsometer

Electrical characterization

Microscopes

Backend & Packaging

Thermal Processing

Wet Processing