Difference between revisions of "Equipment"
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== Lithography == | == Lithography == | ||
==== E-beam Lithography ==== | ==== E-beam Lithography ==== | ||
| − | * EBL-01: [[ Elionix ELS-7500EX E-Beam Lithography System | Elionix ELS-7500EX E-Beam Lithography System ]] | + | * '''EBL-01:''' [[ Elionix ELS-7500EX E-Beam Lithography System | Elionix ELS-7500EX E-Beam Lithography System ]] |
| − | * EBL-02: [[Litho Workstation for BEAMER and TRACER | Litho Workstation for BEAMER and TRACER]] | + | * '''EBL-02:''' [[Litho Workstation for BEAMER and TRACER | Litho Workstation for BEAMER and TRACER]] |
==== Laser Lithography ==== | ==== Laser Lithography ==== | ||
| − | * LW-01: [[Heidelberg DWL 66+ Laser Writer | Heidelberg DWL 66+ Laser Writer]] | + | * '''LW-01:''' [[Heidelberg DWL 66+ Laser Writer | Heidelberg DWL 66+ Laser Writer]] |
| − | * LW-02: [[Nanoscribe Photonic Professional GT | Nanoscribe Photonic Professional GT]] | + | * '''LW-02:''' [[Nanoscribe Photonic Professional GT | Nanoscribe Photonic Professional GT]] |
==== Photolithography ==== | ==== Photolithography ==== | ||
| − | * MA-01: [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]] | + | * '''MA-01:''' [[SUSS MicroTec MA6 Gen3 Mask Aligner | SUSS MicroTec MA6 Gen3 Mask Aligner]] |
==== Imprint Lithography ==== | ==== Imprint Lithography ==== | ||
| − | * MA-02: [[Nanonex NX2600 Nanoimprint | Nanonex NX2600 Nanoimprint]] | + | * '''MA-02:''' [[Nanonex NX2600 Nanoimprint | Nanonex NX2600 Nanoimprint]] |
==== Resist Coating ==== | ==== Resist Coating ==== | ||
| − | * RC-01: [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]] | + | * '''RC-01:''' [[SUSS MicroTec AS8 AltaSpray | SUSS MicroTec AS8 AltaSpray]] |
* Spinner - Positive Resist (Left) - 4" Wafer Only | * Spinner - Positive Resist (Left) - 4" Wafer Only | ||
* Spinner - Positive Resist (Right) - Small Piece Only | * Spinner - Positive Resist (Right) - Small Piece Only | ||
Revision as of 13:33, 8 July 2022
Physical Vapor Deposition (PVD)
Evaporation
- PVD-01: Lesker Nano-36 Thermal Evaporator
- PVD-02: Lesker PVD75 E-Beam/Thermal Evaporator
- PVD-04: Lesker PVD75 E-beam Evaporator
Sputtering
- PVD-03: Lesker PVD75 DC/RF Sputterer
- PVD-05: Denton Explorer14 Magnetron Sputterer
PVD-07 is listed under Soft Lithography
Chemical Vapor Deposition (CVD)
- ALD-01: Cambridge Nanotech S200 ALD
- ALD-03: Veeco Savannah 200
- CVD-01: Oxford PlasmaLab 100 PECVD
- CVD-02: Sandvik Furnace Stack - SiO2, SiNx, Anneal tubes
Etching
Plasma Etch
- DE-02: Anatech SCE-108 Barrel Asher
- DE-03: SPTS Si DRIE
- DE-04: Oxford 80 Plus RIE
- DE-05: Oxford Cobra ICP Etcher
- DE-08: Jupiter II RIE Plasma Etcher
Vapor / Wet Etch
Lithography
E-beam Lithography
- EBL-01: Elionix ELS-7500EX E-Beam Lithography System
- EBL-02: Litho Workstation for BEAMER and TRACER
Laser Lithography
Photolithography
Imprint Lithography
- MA-02: Nanonex NX2600 Nanoimprint
Resist Coating
- RC-01: SUSS MicroTec AS8 AltaSpray
- Spinner - Positive Resist (Left) - 4" Wafer Only
- Spinner - Positive Resist (Right) - Small Piece Only
- Spinner - Negative Resist (Left)
- Spinner - Negative Resist (Right)
- Spinner - E-Beam Resist Only
Soft Lithography
- SCE-106: Anatech SCE-106 Barrel Asher
- MA-03: ABM3000HR Mask Aligner
- PVD-07: SCS PDS2010 Parylene Coater
- Silanization Dessicator
- Spinner - SU-8/PDMS
Metrology
- MET-01: KLA Tencor P7 2D profilometer
- MET-02: KLA Tencor P7 2D&3D/stress profilometer
- MET-03: Filmetrics F50 (UV Filter)
- MET-11: Filmetrics F50 (White Light)
- MET-04: Filmetrics F40
- MET-05: Zygo NewView 7300 Optical Profilometer
- MET-06: Woollam V-VASE Ellipsometer
- MET-08: Jandel Multi Height Four Point Probe
- MET-12/13/14/15: Zeiss Axio Imager M2m Microscopes
- Micromanipulator 4060 Probe Station
Backend & Packaging
- IPG IX-255 Excimer Micromachining Laser
- IPG IX280-DXF Green Micromachining Laser
- EVG 510 Wafer Bonder
- EVG 620 Wafer Bond Aligner
- K&S Wire Bonder
- ADT 7100 Dicing Saw
- Tousimis Critical Point Dryer
- Dimatix ink-Jet Printer