Difference between revisions of "Equipment"

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== Deposition ==
+
== Physical vapor deposition (PVD) ==
 
===== Evaporation =====
 
===== Evaporation =====
 
* (PVD-01) [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]]  
 
* (PVD-01) [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]]  

Revision as of 11:43, 8 July 2022

Physical vapor deposition (PVD)

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)

Etch

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing

Retrieved from "https://wiki.nano.upenn.edu/wiki/index.php?title=Equipment&oldid=564"