Difference between revisions of "Equipment"

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== Chemical vapor deposition (CVD) ==
 
== Chemical vapor deposition (CVD) ==
  
* [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
+
* (ALD-01) [[Cambridge Nanotech S200 ALD | Cambridge Nanotech S200 ALD]]
* [[Veeco Savannah 200 | Veeco Savannah 200]]
+
* (ALD-03) [[Veeco Savannah 200 | Veeco Savannah 200]]
* [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]]
+
* (CVD-01) [[Oxford PlasmaLab 100 PECVD | Oxford PlasmaLab 100 PECVD ]]
* [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]]
+
* (CVD-02) [[Sandvik Furnace Stack | Sandvik Furnace Stack - SiO<sub>2</sub>, SiN<sub>x</sub>, Anneal tubes]]
  
 
== Etch ==
 
== Etch ==

Revision as of 11:54, 8 July 2022

Physical vapor deposition (PVD)

Evaporation
Sputtering

Chemical vapor deposition (CVD)

Etch

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing