Difference between revisions of "Equipment"

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== Deposition ==
 
== Deposition ==
 
===== Evaporation =====
 
===== Evaporation =====
* [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]]
+
* [[Lesker Nano-36 Thermal Evaporator | Lesker Nano-36 Thermal Evaporator]] (PVD-01)
* [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]]
+
* [[Lesker PVD75 E-Beam/Thermal Evaporator | Lesker PVD75 E-Beam/Thermal Evaporator]] (PVD-02)
* [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]]
+
* [[Lesker PVD75 E-beam Evaporator | Lesker PVD75 E-beam Evaporator]] (PVD-04)
  
 
===== Sputtering =====
 
===== Sputtering =====

Revision as of 11:38, 8 July 2022

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)

Etch

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing