Difference between revisions of "Equipment"

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* EVG 620 Wafer Bond Aligner
 
* EVG 620 Wafer Bond Aligner
 
* [[K&S Wire Bonder | K&S Wire Bonder]]
 
* [[K&S Wire Bonder | K&S Wire Bonder]]
* ADT 7100 Dicing Saw
+
* [[ADT 7100 Dicing Saw | ADT 7100 Dicing Saw]]
 
* [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]]
 
* [[Tousimis Critical Point Dryer | Tousimis Critical Point Dryer]]
 
* Dimatix ink-Jet Printer  
 
* Dimatix ink-Jet Printer  

Revision as of 11:28, 30 March 2022

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)

Etch

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

Backend & Packaging

Thermal Processing