Difference between revisions of "Equipment"
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| Line 74: | Line 74: | ||
* EVG 510 Wafer Bonder | * EVG 510 Wafer Bonder | ||
* EVG 620 Wafer Bond Aligner | * EVG 620 Wafer Bond Aligner | ||
| − | * K&S Wire Bonder | + | * [[K&S Wire Bonder | K&S Wire Bonder]] |
* ADT 7100 Dicing Saw | * ADT 7100 Dicing Saw | ||
* Tousimis Critical Point Dryer | * Tousimis Critical Point Dryer | ||
Revision as of 11:13, 30 March 2022
Deposition
Evaporation
- Lesker Nano-36 Thermal Evaporator
- Lesker PVD75 E-Beam/Thermal Evaporator
- Lesker PVD75 E-beam Evaporator
Sputtering
Chemical Vapor Deposition (CVD)
- Cambridge Nanotech S200 ALD
- Veeco Savannah 200
- Oxford PlasmaLab 100 PECVD
- Sandvik Wet/Dry Thermal Oxide Furnace
- Sandvik LPCVD Silicon Nitride Furnace
Etch
Plasma Etch
- Anatech SCE-108 Barrel Asher
- SPTS Si DRIE
- Oxford 80 Plus RIE
- Oxford Cobra ICP Etcher
- Jupiter II RIE Plasma Etcher
Vapor / Wet Etch
Lithography
E-beam Lithography
Laser Lithography
Photolithography
Imprint Lithography
Resist Coating
- Spinner - Positive Resist (Left) - 4" Wafer Only
- Spinner - Positive Resist (Right) - Small Piece Only
- Spinner - Negative Resist (Left)
- Spinner - Negative Resist (Right)
- Spinner - E-Beam Resist Only
- SUSS MicroTec AS8 AltaSpray
Soft Lithography
- Anatech SCE-106 Barrel Asher
- ABM3000HR Mask Aligner
- SCS PDS2010 Parylene Coater
- Silanization Dessicator
- Spinner - SU-8/PDMS
Metrology
- KLA Tencor P7 2D profilometer
- KLA Tencor P7 2D&3D/stress profilometer
- Filmetrics F50 (UV Filter)
- Filmetrics F50 (White Light)
- Filmetrics F40
- Zygo NewView 7300 Optical Profilometer
- Woollam V-VASE Ellipsometer
- Jandel Multi Height Four Point Probe
- Micromanipulator 4060 Probe Station
- Zeiss Axio Imager M2m Microscopes
Backend & Packaging
- IPG IX-255 Excimer Micromachining Laser
- IPG IX280-DXF Green Micromachining Laser
- EVG 510 Wafer Bonder
- EVG 620 Wafer Bond Aligner
- K&S Wire Bonder
- ADT 7100 Dicing Saw
- Tousimis Critical Point Dryer
- Dimatix ink-Jet Printer