Difference between revisions of "Equipment"

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* [[Filmetrics F40 | Filmetrics F40]]
 
* [[Filmetrics F40 | Filmetrics F40]]
 
* [[Zygo NewView 7300 Optical Profilometer | Zygo NewView 7300 Optical Profilometer]]  
 
* [[Zygo NewView 7300 Optical Profilometer | Zygo NewView 7300 Optical Profilometer]]  
−
* Woollam VAS Ellipsometer
+
* Woollam V-VASE Ellipsometer
 
* Jandel Multi Height Four Point Probe
 
* Jandel Multi Height Four Point Probe
 
* Micromanipulator 4060 Probe Station
 
* Micromanipulator 4060 Probe Station

Revision as of 08:17, 30 March 2022

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)

Etch

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

  • Zeiss Axio Imager M2m Microscopes

Backend & Packaging

  • IPG IX-255 Excimer Micromachining Laser
  • IPG IX280-DXF Green Micromachining Laser
  • EVG 510 Wafer Bonder
  • EVG 620 Wafer Bond Aligner
  • K&S Wire Bonder
  • ADT 7100 Dicing Saw
  • Tousimis Critical Point Dryer
  • Dimatix ink-Jet Printer

Thermal Processing

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