Difference between revisions of "Equipment"

From Quattrone Nanofabrication Facility
Jump to navigation Jump to search
Line 61: Line 61:
 
* [[KLA Tencor P7 2D&3D/stress profilometer | KLA Tencor P7 2D&3D/stress profilometer]]
 
* [[KLA Tencor P7 2D&3D/stress profilometer | KLA Tencor P7 2D&3D/stress profilometer]]
 
* [[Filmetrics F50 (UV Filter) | Filmetrics F50 (UV Filter)]]
 
* [[Filmetrics F50 (UV Filter) | Filmetrics F50 (UV Filter)]]
 +
* [[Filmetrics F50 (White Light) | Filmetrics F50 (White Light)]]
 
* Filmetrics F40
 
* Filmetrics F40
 
* Zygo NewView 7300 Optical Profilometer  
 
* Zygo NewView 7300 Optical Profilometer  
Line 66: Line 67:
 
* Jandel Multi Height Four Point Probe
 
* Jandel Multi Height Four Point Probe
 
* Micromanipulator 4060 Probe Station
 
* Micromanipulator 4060 Probe Station
* Filmetrics F50 (white light)
+
 
 
* Zeiss Axio Imager M2m Microscopes
 
* Zeiss Axio Imager M2m Microscopes
 
   
 
   

Revision as of 16:58, 29 March 2022

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)

Etch

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

  • Zeiss Axio Imager M2m Microscopes

Backend & Packaging

  • IPG IX-255 Excimer Micromachining Laser
  • IPG IX280-DXF Green Micromachining Laser
  • EVG 510 Wafer Bonder
  • EVG 620 Wafer Bond Aligner
  • K&S Wire Bonder
  • ADT 7100 Dicing Saw
  • Tousimis Critical Point Dryer
  • Dimatix ink-Jet Printer

Thermal Processing