Difference between revisions of "Equipment"

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== Metrology ==
 
== Metrology ==
 
* [[KLA Tencor P7 2D profilometer | KLA Tencor P7 2D profilometer]]
 
* [[KLA Tencor P7 2D profilometer | KLA Tencor P7 2D profilometer]]
* KLA Tencor P7 2D&3D/stress profilometer  
+
* [[KLA Tencor P7 2D&3D/stress profilometer | KLA Tencor P7 2D&3D/stress profilometer]]
 
* Filmetrics F50 (yellow light)
 
* Filmetrics F50 (yellow light)
 
* Filmetrics F40
 
* Filmetrics F40

Revision as of 15:44, 29 March 2022

Deposition

Evaporation
Sputtering
Chemical Vapor Deposition (CVD)

Etch

Plasma Etch

Vapor / Wet Etch

Lithography

E-beam Lithography

Laser Lithography

Photolithography

Imprint Lithography

Resist Coating

  • Spinner - Positive Resist (Left) - 4" Wafer Only
  • Spinner - Positive Resist (Right) - Small Piece Only
  • Spinner - Negative Resist (Left)
  • Spinner - Negative Resist (Right)
  • Spinner - E-Beam Resist Only
  • SUSS MicroTec AS8 AltaSpray

Soft Lithography

Metrology

Backend & Packaging

  • IPG IX-255 Excimer Micromachining Laser
  • IPG IX280-DXF Green Micromachining Laser
  • EVG 510 Wafer Bonder
  • EVG 620 Wafer Bond Aligner
  • K&S Wire Bonder
  • ADT 7100 Dicing Saw
  • Tousimis Critical Point Dryer
  • Dimatix ink-Jet Printer

Thermal Processing