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- 08:20, 26 August 2025 diff hist -96 CEE Apogee Spinner updated SOP
- 08:15, 26 August 2025 diff hist +102 N File:SPN-xx SOP v06.pdf Apogee spinner SOP, v6 removes HMDS spin-on suggestions, adds more cleaning instructions current
- 14:01, 30 July 2025 diff hist +1,875 Soft Lithography
- 12:56, 30 July 2025 diff hist -8 Soft Lithography
- 12:56, 30 July 2025 diff hist 0 Soft Lithography
- 12:55, 30 July 2025 diff hist 0 Soft Lithography →Process Flow
- 12:55, 30 July 2025 diff hist +41 Soft Lithography →Process Flow
- 12:55, 30 July 2025 diff hist +23 Soft Lithography →Process Flow
- 12:54, 30 July 2025 diff hist -38 m Soft Lithography
- 12:54, 30 July 2025 diff hist +27 Soft Lithography
- 12:47, 30 July 2025 diff hist +4 Soft Lithography →Internal Reports
- 12:46, 30 July 2025 diff hist +38 Soft Lithography →Internal Reports
- 12:45, 30 July 2025 diff hist +65 Soft Lithography
- 12:41, 30 July 2025 diff hist +68 N File:SOP Microfluidics.pdf Contains visual steps for soft lithography fabrication current
- 09:58, 30 July 2025 diff hist 0 Resists at QNF Move HARE SQ 2 to stockroom
- 09:57, 30 July 2025 diff hist +8 Developers at QNF Removed AZ422 current
- 10:21, 29 July 2025 diff hist +9 Staff
- 10:10, 29 July 2025 diff hist +161 Soft Lithography
- 15:43, 28 July 2025 diff hist +4 Heidelberg DWL 66+ Laser Writer →Other direct writes current
- 15:42, 28 July 2025 diff hist +27 Heidelberg DWL 66+ Laser Writer →Other direct writes
- 15:39, 28 July 2025 diff hist +49 Heidelberg DWL 66+ Laser Writer →Other direct writes
- 15:29, 28 July 2025 diff hist +22 Heidelberg DWL 66+ Laser Writer →Mask Plates
- 15:28, 28 July 2025 diff hist +198 Heidelberg DWL 66+ Laser Writer →Mask Plates: split into two for better information comprehension
- 15:17, 28 July 2025 diff hist +29 Heidelberg DWL 66+ Laser Writer →Writehead Selection
- 15:16, 28 July 2025 diff hist -175 Heidelberg DWL 66+ Laser Writer →Writehead Selection: update layout for simplification of focus values
- 15:04, 28 July 2025 diff hist +86 Quattrone Nanofabrication Facility →Resources current
- 13:26, 28 July 2025 diff hist +1,520 Photolithography
- 13:21, 28 July 2025 diff hist +141 Soft Lithography
- 13:14, 28 July 2025 diff hist +20 m Lesker PVD75 E-beam Evaporator →Available materials
- 13:13, 28 July 2025 diff hist +20 Lesker PVD75 E-Beam/Thermal Evaporator →Metals and metalloids current
- 13:12, 28 July 2025 diff hist +29 Oxford Cobra ICP Etcher →Applications current
- 13:12, 28 July 2025 diff hist +29 Oxford 80 Plus RIE →Applications current
- 13:09, 28 July 2025 diff hist +28 Lesker PVD75 E-Beam/Thermal Evaporator →Oxides
- 13:06, 28 July 2025 diff hist +29 Sandvik Furnace Stack →Description current
- 13:06, 28 July 2025 diff hist 0 Cambridge Nanotech S200 ALD →Description
- 13:01, 28 July 2025 diff hist 0 Oxford PlasmaLab 100 PECVD
- 13:00, 28 July 2025 diff hist +29 Oxford PlasmaLab 100 PECVD →Allowed material in PECVD System
- 12:59, 28 July 2025 diff hist +29 Cambridge Nanotech S200 ALD →Allowed material in ALD System
- 12:56, 28 July 2025 diff hist +20 General Wet Bench Processing current
- 12:55, 28 July 2025 diff hist +22 m RENA Compass Dual Stack Spin Rinse Dryer current
- 12:55, 28 July 2025 diff hist +22 m Tousimis Critical Point Dryer current
- 12:55, 28 July 2025 diff hist +31 m Sandvik Furnace Stack
- 12:54, 28 July 2025 diff hist +22 m RTA-02 current
- 12:54, 28 July 2025 diff hist +22 RTA-01 current
- 12:53, 28 July 2025 diff hist -26 m Equipment →Thermal Processing
- 12:53, 28 July 2025 diff hist +79 Equipment →Rapid Thermal Annealing
- 12:50, 28 July 2025 diff hist +35 Equipment →Wet Processing: categorized
- 12:49, 28 July 2025 diff hist +55 m Equipment →Thermal Processing: categorize
- 12:45, 28 July 2025 diff hist +138 Equipment →Backend & Packaging: categorized
- 12:39, 28 July 2025 diff hist +32 m SCS PDS2010 Parylene Coater current