Developers at QNF
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The following are developers you may encounter in the QNF wet benches.
Please note: Cross contaminating inorganic developer baths with TMAH-based metal ion free developers, even at parts per million levels, will degrade or completely neutralize the performance of the inorganic developer. Use extreme caution when sharing dishes between a TMAH based developer and an inorganic process.
| Name | Manufacturer | Chemical Composition | Hazards | Use | Alternatives |
|---|---|---|---|---|---|
| TMAH 0.26N | KemLab | 0.26N TMAH (Metal Ion Free) | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | Photoresist Development (e.g. S1800 series, IP3500), Liftoff Resists, HMDS Removal, Aluminum Etchant | CD-26, AZ300MIF |
| CD-26 | Microposit/Dupont | 0.26N TMAH (Metal Ion Free) | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant | TMAH 0.26N (preferred), AZ300MIF |
| AZ300 MIF | AZ Materials/Merck | 0.26N TMAH (Metal Ion Free) | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant | TMAH 0.26N (preferred), CD-26 |
| CD-26A | Microposit/Dupont | 0.26N TMAH (Metal Ion Free) w/ Surfactant | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant | AZ917MIF, TMAH 0.26N, CD-26, AZ300MIF |
| AZ917 MIF | AZ Materials/Merck | 0.26N TMAH (Metal Ion Free) w/ Surfactant | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant | CD-26A, TMAH 0.26N, CD-26, AZ300MIF |
| MF321 | Microposit/Dupont | 0.21N TMAH (Metal Ion Free) w/ Surfactant | Strong Base -- Toxic, Irritant (can cause chemical burns, lethal for high surface areas) | Photoresist Development, Liftoff Resists, HMDS Removal, Aluminum Etchant | AZ422 MIF, TMAH 0.26N |
| AZ400K | AZ Materials/Merck | Potassium Borates (Metal Ion Bearing) | Strong Base -- Irritant, Corrosive | Development of Thick Photoresists (AZP4620), Mask Plates (AZ1500) -- Manually dilute 1:3 or 1:4 with DI water | |
| SU-8 Developer | MicroChem/Kayaku | PGMEA (1-methoxy-2-propanol acetate) | Organic Solvent -- Flammable | SU-8, HARE SQ, IP-S & IP-Dip Development | HARE SQ Developer (preferred) |
| HARE SQ Developer | KemLab | PGMEA (1-methoxy-2-propanol acetate) | Organic Solvent -- Flammable | HARE SQ, SU-8, IP-S & IP-Dip Development | SU-8 Developer |
| O-Xylene | N/A | O-Xylene | Organic Solvent -- Flammable, Irritant | ZEP520 | Amyl Acetate (preferred) |